Electric connection structure and electric connection member

Patent metadata

Field	Value
Publication number	US-10721822-B2
Application number	US-201816182244-A
Country	US
Kind code	B2
Filing date	Nov 6, 2018
Priority date	Feb 26, 2015
Publication date	Jul 21, 2020
Grant date	Jul 21, 2020

Abstract

There is provided an electric connection member having a substrate, an insulating adhesive layer provided on the substrate, and a conductive interconnect, wherein the electric connection member is provided with a recess that opens at a side of the insulating adhesive layer, the conductive interconnect is disposed in the recess, a metal nano-ink is disposed on the conductive interconnect, and all of the metal nano-ink is contained inside the recess.

First claim

What is claimed is:

1. A mounting structure of an electronic component assembly in which an electronic component having an electrode is mounted on an electric connection member comprising a substrate, an insulating adhesive layer provided on the substrate, and a conductive interconnect,
wherein the substrate and the insulating adhesive layer form a laminate body,
the laminate body is provided with a recess that opens at a side of the insulating adhesive layer,
the conductive interconnect is disposed in the recess,
a metal nano-ink is disposed on the conductive interconnect in the recess,
all of the metal nano-ink is contained inside the recess,
the electronic component is disposed relative to the electric connection member such that the electrode is inserted into the recess and a surface of the insulating adhesive layer is in contact with a surface of the electronic component,
the conductive interconnect and the electrode inserted into the recess are electrically connected to each other through the metal nano-ink disposed on the conductive interconnect and sintered in the recess,
the surface of the insulating adhesive layer adheres to the surface of the electronic component,
the recess has a depth greater than a thickness of the insulating adhesive layer,
the recess has a bottom surface located in the substrate, and
the conductive interconnect is disposed on the bottom surface of the recess.

2. The electric connection member according to claim 1 , wherein the substrate is a flexible substrate.

3. An intermediate member used for producing the electric connection member according to claim 1 , the intermediate member comprising a substrate, an insulating adhesive layer provided on the substrate, and a conductive interconnect,
wherein the substrate and the insulating adhesive layer form a laminate body,
the laminate body is provided with a recess that opens at a side of the insulating adhesive layer, and
the conductive interconnect is disposed in the recess.

Assignees

• Japan Aviation Electronics Ind Ltd

Inventors

• Sato Junya
• Mitsui Ryosuke

Classifications

• C09D11/037 Primary

  characterised by the pigment · CPC title

• Y02P70/50

  Manufacturing or production processes characterised by the final manufactured product · CPC title

• C09D11/322

  Pigment inks · CPC title

• H05K2201/09472

  Recessed pad for surface mounting; Recessed electrode of component · CPC title

• C09D11/14

  based on carbohydrates · CPC title