3DIC interconnect apparatus and method
US-10510729-B2 · Dec 17, 2019 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L24/91 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 151 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 16 |
| 2016 | 14 |
| 2017 | 8 |
| 2018 | 12 |
| 2019 | 21 |
| 2020 | 18 |
| 2021 | 14 |
| 2022 | 13 |
| 2023 | 12 |
| 2024 | 13 |
| 2025 | 10 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method of manufacturing power semiconductor device and power semiconductor device
US-2019348404-A1 · Nov 14, 2019 · US
Interconnection structure having a via structure and fabrication thereof
US-10424508-B2 · Sep 24, 2019 · US
Method of manufacturing package-on-package device and bonding apparatus used therein
US-2019273074-A1 · Sep 5, 2019 · US
Method of determining curing conditions, method of producing circuit device and circuit device
US-2019267348-A1 · Aug 29, 2019 · US
Semiconductor Packages and Methods of Forming Same
US-2019267354-A1 · Aug 29, 2019 · US
Stacked Integrated Circuits with Redistribution Lines
US-2019252354-A1 · Aug 15, 2019 · US
Three-dimensional memory device and fabrication method thereof
US-2019221558-A1 · Jul 18, 2019 · US
Semiconductor packages and methods of forming same
US-10290611-B2 · May 14, 2019 · US
3DIC Interconnect Apparatus and Method
US-2019115322-A1 · Apr 18, 2019 · US
3DIC interconnect apparatus and method
US-10157891-B2 · Dec 18, 2018 · US
Semiconductor package having routable encapsulated conductive substrate and method
US-2018323129-A1 · Nov 8, 2018 · US
Bump base reinforcement sheet
US-2018304603-A1 · Oct 25, 2018 · US
Adhesive film, preparation method of semiconductor device, and semiconductor device
US-2018265758-A1 · Sep 20, 2018 · US
Inkjet adhesive, manufacturing method for semiconductor device, and electronic component
US-10066118-B2 · Sep 4, 2018 · US
Semiconductor package having routable encapsulated conductive substrate and method
US-10049954-B2 · Aug 14, 2018 · US
Method for manufacturing semiconductor device
US-2018174998-A1 · Jun 21, 2018 · US
Method of determining curing conditions, method of producing circuit device, and circuit device
US-9997491-B2 · Jun 12, 2018 · US
Method of determining curing conditions, method of producing circuit device, and circuit device
US-2018114771-A1 · Apr 26, 2018 · US
Semiconductor package and method for preparing same
US-2018090448-A1 · Mar 29, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L24/91?
- CPC H01L24/91 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L24/91 (Electricity)?
- Our database includes 151 publications tagged with this CPC code.
- Is patent activity under CPC H01L24/91 growing?
- Publication counts under this code: 13 in 2024 vs 10 in 2025 (latest complete years).