Method of determining curing conditions, method of producing circuit device, and circuit device

Patent metadata

Field	Value
Publication number	US-9997491-B2
Application number	US-201414406958-A
Country	US
Kind code	B2
Filing date	Apr 16, 2014
Priority date	Jul 8, 2013
Publication date	Jun 12, 2018
Grant date	Jun 12, 2018

Abstract

A method of determining curing conditions is for determining the curing conditions of a thermosetting resin to seal a conductive part between a substrate and an electronic component. A curing degree curve is created. The curing degree curve indicates, with respect to each of heating temperatures, relationship between heating time and curing degree of the thermosetting resin. On the basis of the created curing degree curve, a void removal time of a void naturally moving upward in the thermosetting resin, at a first heating temperature, is calculated. The first heating temperature is one of the heating temperatures.

First claim

The invention claimed is:

1. A method of determining curing conditions of a thermosetting resin to seal a conductive part between a substrate and an electronic component, the method comprising:
creating a curing degree curve which indicates, with respect to each of heating temperatures, relationship between heating time and curing degree of the thermosetting resin;
calculating, on the basis of the created curing degree curve, a void removal time of a void naturally moving upward in the thermosetting resin at a first heating temperature which is one of the heating temperatures; and
determining a time based on the calculated void removal time, as a heating time at the first heating temperature,
wherein,
the calculating includes (a) converting the created curing degree curve to viscosity of the thermosetting resin, and (b) calculating the void removal time based on an equation representing a state of the natural upward movement of the void, using as a parameter the viscosity obtained from the conversion,
the equation representing the state of the natural upward movement of the void further uses as a parameter a diameter of the void, and
the calculation of the void removal time includes calculating the void removal time based on an equation representing relationship between the diameter of the void and a pressure being applied to the void.

2. A method of producing a circuit device, the method comprising:
calculating, on the basis of a curing degree curve, a void removal time of a void naturally moving upward in a thermosetting resin at a first heating temperature which is one of plural heating temperatures, in which the curing degree curve indicates, with respect to each of the heating temperatures, relationship between heating time and curing degree of the thermosetting resin;
providing the thermosetting resin onto a substrate so as to cover a solder part provided on an electrode on the substrate;
placing an electronic component on the substrate in such a manner that an electrode of the electronic component or a solder part provided on this electrode confronts the solder part provided on the electrode on the substrate being provided with the thermosetting resin;
heating the thermosetting resin at the first heating temperature, until a time based on the void removal time obtained by the calculation elapses from starting heating; and
heating the thermosetting resin at a second heating temperature after the time based on the void removal time has elapsed from starting heating, the second heating temperature being lower than the first heating temperature.

3. The method of producing a circuit device according to claim 2 , wherein the heating of the thermosetting resin includes heating the thermosetting resin from both a side of the electronic component and a side of the mounting substrate.

4. The method of producing a circuit device according to claim 2 , wherein the thermosetting resin is an epoxy resin.

5. The method of producing a circuit device according to claim 2 , wherein the first heating temperature is 200° C. or higher and 250° C. or lower.

6. The method of producing a circuit device according to claim 2 , wherein
the second heating temperature is 100° C. or higher and 150° C. or lower.

7. The method of producing a circuit device according to claim 2 , wherein the calculating includes (a) converting the created curing degree curve to viscosity of the thermosetting resin, and (b) calculating the void removal time based on an equation representing an ascent rate or a position by the natural upward movement of the void, using as a parameter the viscosity obtained from the conversion.

8. The method of producing a circuit device according to claim 2 , wherein the placing of the electronic component on the substrate includes:
bringing the electronic component into contact with the thermosetting resin on the substrate in a state where: an electrode arrangement surface of the electronic component on which the electrode is disposed, or a solder arrangement surface on which the solder part provided on the electrode is disposed, is angled with respect to a mounting surface of the substrate on which the electrode of the substrate is disposed; and
pressing the electronic component against the thermosetting resin, after the contact, in such a manner that the angle between the mounting surface of the substrate and the electrode arrangement surface or the solder arrangement surface of the electronic component is lowered.

9. A method of curing a thermosetting resin comprising: calculating curing conditions for the thermosetting resin by (I) creating a curing degree curve which indicates, with respect to each of heating temperatures, relationship between heating time and curing degree of the thermosetting resin; (II) calculating, on the basis of the created curing degree curve, a void removal time of a void naturally moving upward in the thermosetting resin at a first heating temperature which is one of the heating temperatures; and (III) determining a time based on the calculated void removal time, as a heating time at the first heating temperature; and
curing the thermosetting resin using the calculated curing conditions,
wherein, the calculating includes (a) converting the created curing degree curve to viscosity of the thermosetting resin, and (b) calculating the void removal time based on an equation representing a state of the natural upward movement of the void, using as a parameter the viscosity obtained from the conversion, the equation representing the state of the natural upward movement of the void further uses as a parameter a diameter of the void, and the calculation of the void removal time includes calculating the void removal time based on an equation representing relationship between the diameter of the void and a pressure being applied to the void.

Assignees

• Sony Corp

Inventors

• Ichimura Takeshi

Classifications

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07338

  hardening the adhesive by curing, e.g. thermosetting · CPC title

• H10W72/07332

  Compression bonding, e.g. thermocompression bonding · CPC title