Inkjet adhesive, manufacturing method for semiconductor device, and electronic component

Patent metadata

Field	Value
Publication number	US-10066118-B2
Application number	US-201615518723-A
Country	US
Kind code	B2
Filing date	Jan 20, 2016
Priority date	Jan 22, 2015
Publication date	Sep 4, 2018
Grant date	Sep 4, 2018

Abstract

Provided is an inkjet adhesive which is applied using an inkjet device, wherein the adhesive can suppress generation of voids in the adhesive layer and, after bonding, can reduce an outgas at the time of being exposed to high temperatures, and can enhance moisture-resistant reliability. An inkjet adhesive according to the present invention comprises a first photocurable compound having one (meth)acrylol group, a second photocurable compound having two or more (meth)acrylol groups, a photo-radical initiator, a thermosetting compound having one or more cyclic ether groups or cyclic thioether groups, and a compound capable of reacting with the thermosetting compound, and the first photocurable compound contains alkyl (meth)acrylate having 8 to 21 carbon atoms.

First claim

The invention claimed is:

1. An inkjet adhesive comprising a first photocurable compound having one (meth)acryloyl group,
a second photocurable compound having two or more (meth)acryloyl groups,
a photo-radical initiator,
a thermosetting compound having one or more cyclic ether groups or cyclic thioether groups,
a compound capable of reacting with the thermosetting compound, and
a photocurable and thermosetting compound having one or more (meth)acryloyl groups and one or more epoxy groups or thiirane groups,
the first photocurable compound containing alkyl (meth)acrylate having 8 to 21 carbon atoms.

2. The inkjet adhesive according to claim 1 , wherein in 100 wt % of the total of the first photocurable compound and the second photocurable compound, the content of the first photocurable compound is at least 50 wt % and at most 99.9 wt % and the content of the second photocurable compound is at least 0.1 wt % and at most 50 wt %.

3. The inkjet adhesive according to claim 1 , wherein the thermosetting compound having one or more cyclic ether groups or cyclic thioether groups contains a thermosetting compound having one or more epoxy groups or thiirane groups.

4. The inkjet adhesive according to claim 1 , wherein the photocurable and thermosetting compound contains 4-hydroxybutyl (meth)acrylate glycidyl ether.

5. The inkjet adhesive according to claim 1 , wherein the viscosity at 25° C. and at 10 rpm measured according to JIS K 2283 is at least 5 mPa·s and at most 1600 mPa·s.

6. A method for producing a semiconductor device comprising:
an application step of applying the inkjet adhesive according to claim 1 onto the surface of a support member for mounting a semiconductor element or the surface of a semiconductor element using an inkjet device to form an adhesive layer;
a step of allowing curing of the adhesive layer to proceed by light irradiation to form a B-staged adhesive layer;
a step of laminating a semiconductor element on the surface opposite to a side of the support member or the semiconductor element of the B-staged adhesive layer; and
a step of thermally curing the B-staged adhesive layer after the lamination of the semiconductor element.

7. A method for producing a semiconductor device comprising:
an application step of ejecting the inkjet adhesive according to claim 1 to the surface of a semiconductor wafer using an inkjet device to form an adhesive layer;
a step of allowing curing of the adhesive layer to proceed by light irradiation to form a B-staged adhesive layer;
a step of laminating a cover glass on the surface opposite to a side of the semiconductor wafer of the B-staged adhesive layer to prepare a laminate;
a step of thermally curing the B-staged adhesive layer in the laminate; and
a step of cutting the laminate after thermal curing.

8. An electronic component comprising a first electronic component main body, a second electronic component main body, and an adhesive layer making connection between the first electronic component main body and the second electronic component main body,
wherein the adhesive layer is a cured product of the inkjet adhesive according to claim 1 .

9. The electronic component according to claim 8 ,
wherein the first electronic component main body is a support member for mounting a semiconductor element or a semiconductor element, and
the second electronic component main body is a semiconductor element.

Assignees

• Sekisui Chemical Co Ltd

Inventors

• Tanikawa Mitsuru
• Watanabe Takashi
• Fujita Yusuke
• Fujita Yoshito
• Yamada Tasuku

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/732

  between stacked chips · CPC title

• H10W90/26

  the stacked chips being of the same size without any chips being laterally offset, e.g. chip stacks having a rectangular shape · CPC title

• H10W72/07338

  hardening the adhesive by curing, e.g. thermosetting · CPC title