High current power module package with linear operation capabilities and sensing capabilities
US-2024170482-A1 · May 23, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L23/49 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 394 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 4 |
| 2016 | 6 |
| 2017 | 11 |
| 2018 | 30 |
| 2019 | 48 |
| 2020 | 56 |
| 2021 | 37 |
| 2022 | 44 |
| 2023 | 28 |
| 2024 | 53 |
| 2025 | 64 |
| 2026 | 13 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Power semiconductor module arrangement and method for producing the same
US-10510559-B2 · Dec 17, 2019 · US
Semiconductor device
US-10490486-B2 · Nov 26, 2019 · US
Method, apparatus and system to interconnect packaged integrated circuit dies
US-10396055-B2 · Aug 27, 2019 · US
Semiconductor apparatus
US-10325825-B2 · Jun 18, 2019 · US
Semiconductor packaging structure having antenna module
US-2019181535-A1 · Jun 13, 2019 · US
Semiconductor device and electronic apparatus
US-10262924-B2 · Apr 16, 2019 · US
Semiconductor device
US-2019027427-A1 · Jan 24, 2019 · US
Method, apparatus and system to interconnect packaged integrated circuit dies
US-2019019777-A1 · Jan 17, 2019 · US
Wire and method for manufacturing the same
US-2018366345-A1 · Dec 20, 2018 · US
Semiconductor device
US-2018331008-A1 · Nov 15, 2018 · US
Power Semiconductor Module Arrangement and Method for Producing the Same
US-2018330967-A1 · Nov 15, 2018 · US
Semiconductor device
US-10121719-B2 · Nov 6, 2018 · US
Semiconductor device and electric power conversion device having relay terminal directly fixed to an insulating film of base plate
US-10121732-B2 · Nov 6, 2018 · US
Shielded module having compression overmold
US-2018315717-A1 · Nov 1, 2018 · US
Integrated circuit package having wirebonded multi-die stack
US-2018315737-A1 · Nov 1, 2018 · US
Semiconductor device
US-10115658-B2 · Oct 30, 2018 · US
Packaging structure, electronic device, and packaging method
US-2018308789-A1 · Oct 25, 2018 · US
Semiconductor device and electronic apparatus
US-2018286786-A1 · Oct 4, 2018 · US
Isolator integrated circuits with package structure cavity and fabrication methods
US-10074639-B2 · Sep 11, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L23/49?
- CPC H01L23/49 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L23/49 (Electricity)?
- Our database includes 394 publications tagged with this CPC code.
- Is patent activity under CPC H01L23/49 growing?
- Publication counts under this code: 53 in 2024 vs 64 in 2025 (latest complete years).