Semiconductor apparatus

Patent metadata

Field	Value
Publication number	US-10325825-B2
Application number	US-201815921704-A
Country	US
Kind code	B2
Filing date	Mar 15, 2018
Priority date	Sep 29, 2017
Publication date	Jun 18, 2019
Grant date	Jun 18, 2019

Abstract

A semiconductor apparatus includes: a case made of resin; an insert terminal including an external terminal portion embedded in the case and having a first terminal exposed from the case, and an internal terminal portion bent in a L shape with respect to a second terminal of the external terminal portion and having a first surface exposed from the case and an anchor part in close contact with the case; and a bonding wire bonded to the first surface of the internal terminal portion.

First claim

The invention claimed is:

1. A semiconductor apparatus comprising:
a case made of resin;
an insert terminal including an external terminal portion embedded in the case and having a first terminal exposed from the case, and an internal terminal portion bent in an L shape with respect to a second terminal of the external terminal portion, the internal terminal portion having a first surface exposed from the case and an anchor portion, the anchor portion being in close contact with the case and including one of:
a concave portion provided on a second surface of the internal terminal portion that faces in a direction opposite to a direction in which the first surface faces, and
a convex portion provided on the second surface of the internal terminal portion that faces in the direction opposite to the direction in which the first surface faces; and

a bonding wire bonded to the first surface of the internal terminal portion.

2. The semiconductor apparatus according to claim 1 , wherein the anchor portion includes the concave portion provided on the second surface of the internal terminal portion.

3. The semiconductor apparatus according to claim 2 , wherein the concave portion is a recess having a rectangular cross section.

4. The semiconductor apparatus according to claim 2 , wherein the concave portion is a recess having a trapezoidal cross section.

5. The semiconductor apparatus according to claim 3 , wherein a thickness T of the internal terminal portion is 0.5 mm≤T≤3.0 mm,
a recess width W of the concave portion is 0.5 mm≤W≤5 mm, and
a recess depth H of the concave portion is 0.2 mm≤H≤(T−0.3)mm.

6. The semiconductor apparatus according to claim 2 , wherein the concave portion includes a plurality of recesses provided in a grid pattern.

7. The semiconductor apparatus according to claim 1 , wherein the anchor portion includes the convex portion provided on the second surface of the internal terminal portion.

8. The semiconductor apparatus according to claim 7 , wherein a protrusion of the convex portion has a trapezoidal cross section.

9. The semiconductor apparatus according to claim 1 , further comprising a semiconductor device made of SiC in the case.

10. A semiconductor apparatus comprising:
a case made of resin;
an insert terminal including an external terminal portion embedded in the case and having a first terminal exposed from the case, and an internal terminal portion bent in an L shape with respect to a second terminal of the external terminal portion and having a first surface exposed from the case and an anchor portion in close contact with the case, and
a bonding wire bonded to the first surface of the internal terminal portion,
wherein the anchor portion is a first bent portion provided in an extending direction of the internal terminal portion and bent to be embedded in the case.

11. The semiconductor apparatus according to claim 10 , wherein the first bent portion is bent so that an angle γ between the first bent portion and the first surface of the internal terminal portion is 15°≤γ≤90°.

12. The semiconductor apparatus according to claim 10 , wherein the anchor portion further includes:
a second bent portion bending toward the extending direction more than the first bent portion and covered with a resin constituting the case.

13. The semiconductor apparatus according to claim 10 , wherein the first bent portion includes a through hole, and
the through hole is filled with a resin constituting the case.

14. A semiconductor apparatus comprising:
a case made of resin;
an insert terminal including an external terminal portion embedded in the case and having a first terminal exposed from the case, and an internal terminal portion bent in an L shape with respect to a second terminal of the external terminal portion and having a first surface exposed from the case and an anchor portion in close contact with the case; and
a bonding wire bonded to the first surface of the internal terminal portion,
wherein the anchor portion is a side face bent portion provided on a side face side of the internal terminal portion and bent to be embedded in the case.

15. The semiconductor apparatus according to claim 14 ,
wherein the side face bent portion is bent so that an angle ε between the side face bent portion and the first surface of the internal terminal portion is 30°≤ε≤150°.

16. The semiconductor apparatus according to claim 14 , wherein the side face bent portion includes a through hole, and
the through hole is filled with a resin constituting the case.

Assignees

• Mitsubishi Electric Corp

Inventors

• Aoki Nobuchika
• Yoneyama Rei
• Goto Akira
• Yamashita Akihiko

Classifications

• H10W72/5524

  comprising aluminium [Al] · CPC title

• H10W74/127

  characterised by arrangements for sealing or adhesion · CPC title

• H10W72/075

  of bond wires · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title