Semiconductor device including semiconductor chips stacked via relay substrate
US-9508670-B2 · Nov 29, 2016 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L2224/05568 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 476 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 35 |
| 2016 | 72 |
| 2017 | 67 |
| 2018 | 63 |
| 2019 | 52 |
| 2020 | 50 |
| 2021 | 36 |
| 2022 | 26 |
| 2023 | 14 |
| 2024 | 29 |
| 2025 | 25 |
| 2026 | 7 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor substrates with unitary vias and via terminals, and associated systems and methods
US-9508628-B2 · Nov 29, 2016 · US
Reinforced structure for a stack of layers in a semiconductor component
US-9466579-B2 · Oct 11, 2016 · US
Semiconductor integrated circuit device
US-9466559-B2 · Oct 11, 2016 · US
Semiconductor device
US-9461002-B2 · Oct 4, 2016 · US
Semiconductor structure and manufacturing method thereof
US-2016254242-A1 · Sep 1, 2016 · US
Semiconductor device, and manufacturing method for same
US-9419117-B2 · Aug 16, 2016 · US
Method of forming a reliable microelectronic assembly
US-9398700-B2 · Jul 19, 2016 · US
High density interconnection of microelectronic devices
US-9397071-B2 · Jul 19, 2016 · US
Semiconductor structure with an interconnect level having a conductive pad and metallic structure such as a base of a crackstop
US-9397054-B2 · Jul 19, 2016 · US
Semiconductor chip and stacked type semiconductor package having the same
US-9390997-B2 · Jul 12, 2016 · US
Electronic component and manufacturing method for electronic component
US-9355987-B2 · May 31, 2016 · US
Semiconductor structure and manufacturing method thereof
US-9355982-B2 · May 31, 2016 · US
Semiconductor packaging and manufacturing method thereof
US-9355927-B2 · May 31, 2016 · US
Semiconductor device with face-to-face chips on interposer and method of manufacturing the same
US-9349711-B2 · May 24, 2016 · US
Semiconductor device and method for fabricating the same
US-9318471-B2 · Apr 19, 2016 · US
Flip-chip hybridisation of two microelectronic components using a UV anneal
US-9318453-B2 · Apr 19, 2016 · US
Through silicon via structure
US-9299676-B2 · Mar 29, 2016 · US
Semiconductor package with improved redistribution layer design and fabricating method thereof
US-9293403-B2 · Mar 22, 2016 · US
Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers
US-9287229-B2 · Mar 15, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L2224/05568?
- CPC H01L2224/05568 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L2224/05568 (Electricity)?
- Our database includes 476 publications tagged with this CPC code.
- Is patent activity under CPC H01L2224/05568 growing?
- Publication counts under this code: 29 in 2024 vs 25 in 2025 (latest complete years).