Piezoelectric micromachined pressure transducer with high sensitivity and related manufacturing process
US-2023381816-A1 · Nov 30, 2023 · US
Non square semiconductive diaphragm
Non square semiconductive diaphragm · Cooperative Patent Classification (CPC)
Computing, optics, measurement, and control technologies.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | G01L9/005 |
| Official title | {Non square semiconductive diaphragm} |
| Display label | Non square semiconductive diaphragm |
| Total patents | 28 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 3 |
| 2016 | 3 |
| 2017 | 7 |
| 2018 | 4 |
| 2019 | 3 |
| 2020 | 2 |
| 2021 | 1 |
| 2022 | 2 |
| 2023 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Micromechanical pressure sensor device including a diaphragm system and corresponding manufacturing method
US-11788912-B2 · Oct 17, 2023 · US
Silicon carbide-based combined temperature-pressure micro-electro-mechanical system (MEMS) sensor chip and preparation method thereof
US-11686637-B2 · Jun 27, 2023 · US
Silicon carbide-based combined temperature-pressure micro-electro-mechanical system (mems) sensor chip and preparation method thereof
US-2022146352-A1 · May 12, 2022 · US
Capacitive pressure sensors and other devices having a suspended membrane and having rounded corners at an anchor edge
US-11248976-B2 · Feb 15, 2022 · US
Micromechanical pressure sensor device and corresponding manufacturing method
US-2021215559-A1 · Jul 15, 2021 · US
Method of manufacturing physical quantity sensor device and physical quantity sensor device
US-10852318-B2 · Dec 1, 2020 · US
Capacitive Pressure Sensors and Other Devices Having a Suspended Membrane and Having Rounded Corners at an Anchor Edge
US-2020348198-A1 · Nov 5, 2020 · US
Foam pressure sensor
US-10378983-B2 · Aug 13, 2019 · US
Semiconductor pressure sensor
US-10239747-B2 · Mar 26, 2019 · US
Cavity with silicon on insulator MEMS pressure sensing device with an extended shallow cross-shaped cavity
US-10221062-B2 · Mar 5, 2019 · US
Pressure sensor and microphone
US-10082430-B2 · Sep 25, 2018 · US
Method of manufacturing physical quantity sensor device and physical quantity sensor device
US-2018238928-A1 · Aug 23, 2018 · US
Cavity with silicon on insulator mems pressure sensing device with an extended shallow polygon cavity
US-2018093881-A1 · Apr 5, 2018 · US
MEMS chip, measuring element and pressure sensor for measuring a pressure
US-9927316-B2 · Mar 27, 2018 · US
Pressure sensor and microphone
US-2017356810-A1 · Dec 14, 2017 · US
Semiconductor pressure sensor
US-2017349430-A1 · Dec 7, 2017 · US
Pressure sensor and microphone
US-9759618-B2 · Sep 12, 2017 · US
MEMS pressure sensor with thermal compensation
US-9751750-B2 · Sep 5, 2017 · US
Differential pressure sensor with a capacitive read out system
US-9726561-B2 · Aug 8, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC G01L9/005?
- CPC G01L9/005 is the Cooperative Patent Classification code for “Non square semiconductive diaphragm.”
- How many patents are filed under CPC G01L9/005 (Non square semiconductive diaphragm)?
- Our database includes 28 publications tagged with this CPC code.
- Is patent activity under CPC G01L9/005 growing?
- Publication counts under this code: 2 in 2022 vs 3 in 2023 (latest complete years).