Method of manufacturing physical quantity sensor device and physical quantity sensor device

Patent metadata

Field	Value
Publication number	US-10852318-B2
Application number	US-201815866028-A
Country	US
Kind code	B2
Filing date	Jan 9, 2018
Priority date	Feb 23, 2017
Publication date	Dec 1, 2020
Grant date	Dec 1, 2020

Abstract

An inner housing part has through-holes for connecting first lead pins (power supply terminal, output terminal, ground terminal) with the connector pins. The inner housing part has grooves that house second lead pins for adjusting output signals of a sensor chip. Three of the grooves each has a shape in which a distance between opposing sides of the groove is less than a diameter of the second lead pin that corresponds to the groove. The inner housing part is fixed to a case by a thermoset adhesive so as to house lead pins arranged in the case included in a sensor element. The second lead pins are fitted in the grooves, suppressing lifting of the inner housing part during curing of the adhesive.

First claim

What is claimed is:

1. A method of manufacturing a physical quantity sensor device, the method comprising:
preparing a measured-medium intake part, first terminals, a sensor element, and a first housing part for sandwiching the sensor element with the measured-medium intake part, wherein
the measured-medium intake part has an intake hole that guides a measured medium is one of a gas subject to measurement and a liquid subject to measurement,
the sensor element is fixed on a base so as to cover the intake hole, the base being provided at one end of the intake hole of the measured-medium intake part,
each of the first terminals has a protruding portion protruding from the sensor element toward a side opposite to a side in which the measured-medium intake part is to be disposed, the first terminals including a third terminal and a fourth terminal, and
the first housing part has a first hole and a second hole, the first housing part having therein a second terminal for connecting the sensor element to external wiring,
the method further comprising:
inserting the fourth terminal into the first hole of the first housing part to connect the sensor element to the first housing part, and inserting the third terminal into the second hole of the first housing part to connect the sensor element to the second terminal;
applying an adhesive between the sensor element and the first housing part, and curing the adhesive to fix the first housing part to the sensor element; and
adjusting or trimming the sensor element using the fourth terminal,
wherein the first hole has a cross-sectional shape in which a distance between opposing sides of a cross section of the first hole is less than a diameter of the fourth terminal to be housed in the first hole, for suppressing lifting the first housing part from the sensor element during a process of curing the adhesive, such that adhesion of the sensor element and the first housing part is stabilized.

2. The method according to claim 1 , wherein the first hole is disposed in plurality in the first housing part, a number of first holes being in a range from two to three.

3. The method according to claim 1 , wherein the first housing part includes three first holes.

4. The method according to claim 1 , wherein
the sensor element includes a sensor chip that includes a sensor and a control circuit electrically connected to the sensor,
the third terminal is inserted into the second hole for electrically connecting the control circuit and the second terminal, and
the fourth terminal is prepared in plurality, and the first hole is disposed in plurality, each fourth terminal being inserted into a corresponding one of the first holes.

5. The method according to claim 1 , wherein
the sensor element includes a sensor chip that includes a sensor and a control circuit electrically connected to the sensor,
the third terminal is prepared in plurality, and the second hole is a through-hole and is disposed in plurality in the first housing part, each third terminal being inserted into a corresponding one of the second holes for electrically connecting the control circuit and the second terminal,
the fourth terminal is prepared in plurality, and the first hole is a groove and is disposed in plurality in the first housing part, each fourth terminals being inserted into one of a corresponding second holes, and
the second terminal has a first part to which said each third terminal is to be electrically connected.

6. The method according to claim 1 , wherein
the first housing part is constituted by:
a second housing part for sandwiching the sensor element with the measured-medium intake part and for housing the first terminals, and a part of the second terminal; and
a third housing part for sandwiching the second housing part with the sensor element and housing the rest of the second terminal.

7. The method according to claim 1 , wherein the first housing part is made of a resin.

8. The method according to claim 1 , wherein
the sensor element includes the sensor chip and a case, and
the case is made of a metal and is fixed on the base.

9. The method according to claim 1 , wherein
inserting the fourth terminal into the first hole of the first housing includes inserting the fourth terminals into the first hole by deforming the fourth terminal so as to fit the first hole.

10. The method according to claim 1 , wherein each of the first terminals has the same length.

11. A physical quantity sensor device comprising:
a measured-medium intake part having an intake hole that guides a measured medium that is one of a gas subject to measurement and a liquid subject to measurement, the measured-medium intake part having a base provided at one end of the intake hole;
a sensor element fixed on the base so as to cover the intake hole;
first terminals each having a protruding portion protruding from the sensor element toward a side opposite to a side in which the measured-medium intake part is disposed, the first terminals including a third terminal and a fourth terminal;
a first housing part sandwiching the sensor element with the measured-medium intake part and fixed to the sensor element by an adhesive in the physical quantity sensor device, the first housing part including
a first hole in which the protruding portion of the fourth terminal is inserted to connect the sensor element to the first housing part, wherein the first hole has a cross-sectional shape in which a distance between opposing sides of a cross section of the first hole is less than a diameter of the fourth terminal, for suppressing lifting the first housing part from the sensor element during a process of curing the adhesive, such that adhesion of the sensor element and the first housing part is stabilized;
a second hole in which the protruding portion of the third terminal is inserted to at least one of adjust or trim the sensor element; and
a second terminal for connecting the sensor element and external wiring.

12. The physical quantity sensor device according to claim 11 , wherein the first housing part includes a number of first holes in a range from one hole to three holes.

13. The physical quantity sensor device according to claim 11 , wherein the first housing part includes three first holes.

14. The physical quantity sensor device according to claim 11 , wherein
the sensor element includes a sensor chip that includes a sensor and a control circuit electrically connected to the sensor,
the third terminal is inserted in the second hole electrically connecting the control circuit and the second terminal, and
the fourth terminal is disposed in plurality, and the first hole is disposed in plurality, in each of which a corresponding one of the fourth terminals is inserted.

15. The physical quantity sensor device according to claim 11 , wherein
the sensor element includes a sensor chip that includes a sensor and a control circuit electrically connected to the sensor,
the third terminal is disposed in plurality, and the second hole is a through-hole and is disposed in plurality in the first housing part, each third terminal being inserted into a corresponding one of the second holes to electrically connect the control circuit and the second terminal, and
the fourth terminal is disposed in plurality, and the first hole is a groove and is disposed in plurality in the first housing part, each fourth terminal being inserted into a corresponding one of the first holes,
the second terminal has a first part to which said each third terminal is electrically connected.

16. The physical quantity

Assignees

• Fuji Electric Co Ltd

Inventors

• Ueno Fumiya

Classifications

• G01L9/005 Primary

  Non square semiconductive diaphragm · CPC title

• G01L19/142

  Multiple part housings · CPC title

• G01L19/0084

  to the outside of the housing (other details about the housing see G01L19/14) · CPC title

• G01L19/147

  Details about the mounting of the sensor to support or covering means · CPC title

• G01P1/023

  for acceleration measuring devices · CPC title