Micromechanical pressure sensor device including a diaphragm system and corresponding manufacturing method

Patent metadata

Field	Value
Publication number	US-11788912-B2
Application number	US-201916972588-A
Country	US
Kind code	B2
Filing date	Jun 28, 2019
Priority date	Jul 10, 2018
Publication date	Oct 17, 2023
Grant date	Oct 17, 2023

Abstract

A micromechanical pressure sensor device and a corresponding manufacturing method. The micromechanical pressure sensor device is equipped with a sensor substrate; a diaphragm system that is anchored in the sensor substrate and that includes a first diaphragm and a second diaphragm situated spaced apart therefrom, which are circumferentially connected to one another in an edge area and enclose a reference pressure in an interior space formed in between; and a plate-shaped electrode that is suspended in the interior space and that is situated spaced apart from the first diaphragm and from the second diaphragm and forms a first capacitor with the first diaphragm and forms a second capacitor with the second diaphragm. The first diaphragm and the second diaphragm are designed in such a way that they are deformable toward one another when acted on by an external pressure.

First claim

What is claimed is:

1. A micromechanical pressure sensor device, comprising:
a sensor substrate;
a diaphragm system that is anchored in the sensor substrate and that includes a first diaphragm and a second diaphragm situated spaced apart therefrom, which are circumferentially connected to one another in an edge area, and enclose a reference pressure in an interior space formed in between the first and second diaphragm; and
a plate-shaped central electrode that is suspended in the interior space and that is situated spaced apart from the first diaphragm and from the second diaphragm and that forms a first capacitor with the first diaphragm and forms a second capacitor with the second diaphragm;
wherein the first diaphragm and the second diaphragm are configured in such a way that they are deformable toward one another when acted on by an external pressure,
wherein the diaphragm system is situated in a cantilever manner.

2. The micromechanical pressure sensor device as recited in claim 1 , wherein the diaphragm system at the edge area is clamped in the sensor substrate via at least one elastic spring device.

3. The micromechanical pressure sensor device as recited in claim 1 , wherein the first diaphragm and the second diaphragm are electroconductively connected to one another via the edge area.

4. The micromechanical pressure sensor device as recited in claim 1 , wherein the first diaphragm and the second diaphragm are electrically insulatingly connected to one another via the edge area.

5. The micromechanical pressure sensor device as recited in claim 1 , wherein the first diaphragm is exposed to outside toward a first side or toward a second side of the sensor substrate via a cavity, and the second diaphragm is exposed to the outside toward the second side of the sensor substrate.

6. The micromechanical pressure sensor device as recited in claim 1 , wherein the first diaphragm is connected to the central electrode across electrically insulating connecting areas, so that when the first diaphragm is acted on by the external pressure, the central electrode together with the first diaphragm is deformable, and a reference capacitor is formed.

7. The micromechanical pressure sensor device as recited in claim 1 , wherein a separate reference capacitor is formed in the sensor substrate, laterally spaced apart from the diaphragm system.

8. A micromechanical pressure sensor device, comprising:
a sensor substrate;
a diaphragm system that is anchored in the sensor substrate and that includes a first diaphragm and a second diaphragm situated spaced apart therefrom, which are circumferentially connected to one another in an edge area, and enclose a reference pressure in an interior space formed in between the first and second diaphragm; and
a plate-shaped central electrode that is suspended in the interior space and that is situated spaced apart from the first diaphragm and from the second diaphragm and that forms a first capacitor with the first diaphragm and forms a second capacitor with the second diaphragm;
wherein the first diaphragm and the second diaphragm are configured in such a way that they are deformable toward one another when acted on by an external pressure,
wherein the diaphragm system is situated in a cantilever manner, and is anchored in the sensor substrate across at least one extension area that extends laterally away from the diaphragm system.

9. The micromechanical pressure sensor device as recited in claim 8 , wherein the diaphragm system has a cylindrical configuration, and a first extension area and a second extension area are provided which extend tangentially and laterally away from the diaphragm system and are situated diametrically opposite one another.

10. The micromechanical pressure sensor device as recited in claim 8 , wherein the central electrode is situated in a cantilever manner and is anchored in the sensor substrate across the at least one extension area.

11. The micromechanical pressure sensor device as recited in claim 8 , wherein the central electrode is clamped, at least in areas, in the interior space across a clamping area.

12. A method for manufacturing a micromechanical pressure sensor device, comprising the following steps:
forming a diaphragm system that is anchored in a sensor substrate, and includes a first diaphragm and a second diaphragm situated spaced apart from one another and which are circumferentially connected to one another in an edge area and enclose a reference pressure in an interior space formed in between the first and second diaphragms; and
forming a plate-shaped electrode central electrode that is suspended in the interior space and that is situated spaced apart from the first diaphragm and from the second diaphragm, and that forms a first capacitor with the first diaphragm and forms a second capacitor with the second diaphragm, the first diaphragm and the second diaphragm being formed in such a way that they are deformable toward one another when acted on by an external pressure,
wherein the diaphragm system is situated in a cantilever manner.

13. A method for manufacturing a micromechanical pressure sensor device, comprising the following steps:
forming a diaphragm system that is anchored in a sensor substrate, and includes a first diaphragm and a second diaphragm situated spaced apart from one another and which are circumferentially connected to one another in an edge area and enclose a reference pressure in an interior space formed in between the first and second diaphragms; and
forming a plate-shaped electrode central electrode that is suspended in the interior space and that is situated spaced apart from the first diaphragm and from the second diaphragm, and that forms a first capacitor with the first and forms a second capacitor with the second diaphragm, the first diaphragm and the second diaphragm being formed in such a way that they are deformable toward one another when acted on by an external pressure,
wherein the first diaphragm is formed from a first conductive layer that is deposited and structured above a base substrate, the central electrode being formed from a second conductive layer that is deposited and structured above the first conductive layer, and the second diaphragm being formed from third and fourth conductive layers that are deposited and structured above the second conductive layer.

14. The method as recited in claim 13 , wherein the interior space is formed by depositing and structuring a first sacrificial layer in the interior space between the first conductive layer and the second conductive layer, depositing and structuring a second sacrificial layer, and carrying out a sacrificial layer etching process for at least partially removing the first sacrificial layer and the second sacrificial layer after perforation of the third conductive layer in the interior space, after which the third conductive layer is closed by deposition of the fourth conductive layer.

15. A method for manufacturing a micromechanical pressure sensor device, comprising the following steps:
forming a diaphragm system that is anchored in a sensor substrate, and includes a first diaphragm and a second diaphragm situated spaced apart from one another and which are circumferentially connected to one another in an edge area and enclose a reference pressure in an interior space formed in between the first and second diaphragms; and
forming a plate-shaped electrode central electrode that is suspended in the interior space and that is situated spaced apart from the first diaphragm and from the second diaphragm, and that forms a first capacitor with the first and f

Assignees

• Bosch Gmbh Robert

Inventors

• Weber Heribert
• Schmollngruber Peter

Classifications

• G01L9/0048 Primary

  Details about the mounting of the diaphragm to its support or about the diaphragm edges, e.g. notches, round shapes for stress relief · CPC title

• B81B3/0021

  Transducers for transforming electrical into mechanical energy or vice versa (dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00) · CPC title

• B81C1/00182

  Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer · CPC title

• G01L9/005

  Non square semiconductive diaphragm · CPC title

• G01L9/0073 Primary

  using a semiconductive diaphragm · CPC title