Methods of Forming Parts Using Laser Machining
US-2023201968-A1 · Jun 29, 2023 · US
one side electroplating, e.g. substrate conveyed in a bath with inhibited background plating
one side electroplating, e.g. substrate conveyed in a bath with inhibited background plating · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C25D5/028 |
| Official title | {one side electroplating, e.g. substrate conveyed in a bath with inhibited background plating} |
| Display label | one side electroplating, e.g. substrate conveyed in a bath with inhibited background plating |
| Total patents | 71 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 5 |
| 2016 | 6 |
| 2017 | 2 |
| 2018 | 8 |
| 2019 | 12 |
| 2020 | 5 |
| 2021 | 9 |
| 2022 | 9 |
| 2023 | 6 |
| 2024 | 7 |
| 2025 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Wetting method for substrate and plating apparatus
US-2023167572-A1 · Jun 1, 2023 · US
Electroplating apparatus for tailored uniformity profile
US-11549192-B2 · Jan 10, 2023 · US
Leak detection apparatus and method and wafer electroplating method
US-11545378-B2 · Jan 3, 2023 · US
Method for manufacturing wiring board, and wiring board
US-11490528-B2 · Nov 1, 2022 · US
Method for manufacturing wiring board, and wiring board
US-2022304162-A1 · Sep 22, 2022 · US
Electrolytic processing jig and electrolytic processing method
US-11427920-B2 · Aug 30, 2022 · US
Semiconductor device manufacturing jig and method for manufacturing same
US-2022267920-A1 · Aug 25, 2022 · US
Production method for sulfidation detection sensor
US-2022221414-A1 · Jul 14, 2022 · US
Electroplating apparatus
US-11365487-B2 · Jun 21, 2022 · US
Plating apparatus
US-11339496-B2 · May 24, 2022 · US
Leak detection apparatus and method and wafer electroplating method
US-2022084855-A1 · Mar 17, 2022 · US
Substrate holder, plating device, and plating method of substrate
US-11232972-B2 · Jan 25, 2022 · US
Method of forming nickel film and nickel solution used for the method
US-11168405-B2 · Nov 9, 2021 · US
Electroplating apparatus
US-11060201-B2 · Jul 13, 2021 · US
Dynamic modulation of cross flow manifold during elecroplating
US-11047059-B2 · Jun 29, 2021 · US
Film forming method for metal film and film forming apparatus for metal film
US-11035049-B2 · Jun 15, 2021 · US
Electroplating apparatus for tailored uniformity profile
US-2021148001-A1 · May 20, 2021 · US
Contacts for a photovoltaic cell with two active surfaces
US-10998457-B2 · May 4, 2021 · US
Method for manufacturing wiring board, and wiring board
US-2021084774-A1 · Mar 18, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C25D5/028?
- CPC C25D5/028 is the Cooperative Patent Classification code for “one side electroplating, e.g. substrate conveyed in a bath with inhibited background plating.”
- How many patents are filed under CPC C25D5/028 (one side electroplating, e.g. substrate conveyed in a bath with inhibited background plating)?
- Our database includes 71 publications tagged with this CPC code.
- Is patent activity under CPC C25D5/028 growing?
- Publication counts under this code: 7 in 2024 vs 2 in 2025 (latest complete years).