Electroplating apparatus

US11060201B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11060201-B2
Application numberUS-201716081557-A
CountryUS
Kind codeB2
Filing dateMar 2, 2017
Priority dateMar 3, 2016
Publication dateJul 13, 2021
Grant dateJul 13, 2021

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An electroplating apparatus is provided that minimizes unplated regions when an alloy plating layer is provided on the surface of a thread on a steel pipe. An electroplating apparatus (10) includes an electrode (1), sealing members (2, 3), and a plating-solution supply unit (4). The electrode (1) faces the thread (Tm). The sealing member (2) is positioned within the steel pipe (P1). The sealing member (3) is attached to the end portion of the steel pipe (P1) and, together with the sealing member (2), forms a receiving space (8). The plating-solution supply unit (4) includes a plurality of nozzles (42). The nozzles (42) are positioned within the receiving space (8) and adjacent one end of the thread (Tm) and arranged around the pipe axis of the steel pipe (P1). The plating-solution supply unit (4) injects a plating solution between the thread (Tm) and electrode (1) through the nozzles (42). The direction in which plating solution is injected from the nozzles (42) is inclined at an angle larger than 20 degrees and smaller than 90 degrees toward the thread (Tm) relative to a plane perpendicular to the pipe axis.

First claim

Opening claim text (preview).

The invention claimed is: 1. An electroplating apparatus used for a steel pipe having a male thread on an outer periphery of an end portion of the steel pipe, the electroplating apparatus comprising: a sealing member positioned at an end of the steel pipe to seal the steel pipe; a container having an opening to receive the end portion, the container configured to contain the end portion and a plating solution; an electrode located in the container and facing the male thread; a plurality of nozzles positioned within the container and arranged around a pipe axis of the steel pipe for injecting a plating solution between the male thread and the electrode, and a support member located on a side opposite to the opening of the container to support the plurality of nozzles, wherein the plating solution is injected by each of the nozzles in a direction inclined at an angle larger than 20 degrees and smaller than 90 degrees toward the male thread relative to a plane perpendicular to the pipe axis, the support member includes a plating-solution channel for supplying the plating solution to the nozzles, the container forms a receiving space for receiving a plating solution together with the steel pipe and the sealing member, the support member extends from outside the receiving space through an end side of the container into the receiving space, the nozzles are connected to an end of the support member which is located inside the receiving space, and the sealing member positioned at the end of the steel pipe is fixed to the end of the support member to which the nozzles are connected. 2. The electroplating apparatus according to claim 1 , wherein the support member includes a first channel extending along the pipe axis, and wherein the sealing member includes: a disc including a second channel extending to an outer periphery thereof and communicating with the first channel; and packing mounted on the outer periphery of the disc and in contact with an inner periphery of the steel pipe. 3. The electroplating apparatus according to claim 1 , wherein the number of the nozzles is six or larger. 4. The electroplating apparatus according to claim 2 , wherein the number of the nozzles is six or larger.

Assignees

Inventors

Classifications

  • C25D5/028Primary

    one side electroplating, e.g. substrate conveyed in a bath with inhibited background plating · CPC title

  • C25D5/026Primary

    using locally applied jets of electrolyte · CPC title

  • Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance · CPC title

  • Smooth layers · CPC title

  • Electroplating with moving electrolyte e.g. jet electroplating {(using locally applied jets of electrolyte C25D5/026)} · CPC title

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Frequently asked questions

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What does patent US11060201B2 cover?
An electroplating apparatus is provided that minimizes unplated regions when an alloy plating layer is provided on the surface of a thread on a steel pipe. An electroplating apparatus (10) includes an electrode (1), sealing members (2, 3), and a plating-solution supply unit (4). The electrode (1) faces the thread (Tm). The sealing member (2) is positioned within the steel pipe (P1). The sealing…
Who is the assignee on this patent?
Nippon Steel & Sumitomo Metal Corp, Vallourec Oil & Gas France, Nippon Steel Corp
What technology area does this patent fall under?
Primary CPC classification C25D5/028. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jul 13 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).