Method of forming nickel film and nickel solution used for the method

Patent metadata

Field	Value
Publication number	US-11168405-B2
Application number	US-201815864117-A
Country	US
Kind code	B2
Filing date	Jan 8, 2018
Priority date	Mar 23, 2017
Publication date	Nov 9, 2021
Grant date	Nov 9, 2021

Abstract

A nickel film is formed on the surface of a metal substrate with a solid electrolyte membrane in contact with a metal substrate while suppressing the corrosion taking place on the metal substrate by a method of forming a nickel film comprising: disposing an anode, a metal substrate that functions as a cathode, and a solid electrolyte membrane comprising a solution that contains nickel ions and chloride ions, such that the solid electrolyte membrane is disposed between the anode and the metal substrate and in contact with the surface of the metal substrate; and applying a voltage between the anode and the metal substrate, so as to form a nickel film on the surface of the metal substrate that is in contact with the solid electrolyte membrane, wherein the concentration of the chloride ions is 0.002 to 0.1 mol/l.

First claim

What is claimed is:

1. A method of forming a nickel film comprising:
disposing an anode, a metal substrate that functions as a cathode, and a solid electrolyte membrane comprising a solution that consists of at least one nickel salt, at least one chloride ion source, and at least one of a solvent or a pH buffer solution, such that the solid electrolyte membrane is disposed between the anode and the metal substrate and in contact with the surface of the metal substrate; and
applying a voltage between the anode and the metal substrate so as to form a nickel film on the surface of the metal substrate that is in contact with the solid electrolyte membrane,
wherein the at least one chloride ion source is nickel chloride, hydrochloric acid, sodium chloride or potassium chloride,
wherein the at least one nickel salt is selected from the group consisting of nickel chloride, nickel sulfate, and nickel acetate,
wherein the at least one nickel salt and the at least one chloride ion source can both be nickel chloride,
wherein the at least one nickel salt is at least the nickel sulfate and the nickel sulfate is contained in an amount of 0.900 to 0.949 mol/l, and
wherein a concentration of chloride ions in the solution is 0.01 to 0.02 mol/l.

2. The method of forming a nickel film according to claim 1 , wherein the solution has a pH level of 3 to 3.5.

3. The method of forming a nickel film according to claim 1 , wherein the metal substrate is an aluminum substrate.

4. The method of forming a nickel film according to claim 1 , wherein the solution has a pH level of 2.5 to 3.5.

5. The method of forming a nickel film according to claim 1 , wherein the solution has a pH level of 2.5-4.25.

6. The method of forming a nickel film according to claim 1 , wherein a concentration of nickel ions in the solution is 0.1 to 8 mol/l.

7. The method of forming a nickel film according to claim 1 , wherein the at least one nickel salt is the nickel chloride, the nickel sulfate and the nickel acetate.

8. The method of forming a nickel film according to claim 1 , wherein the pH buffer solution is acetic acid-nickel acetate buffer solution or a succinic acid-nickel succinate buffer solution.

9. A solution consisting of at least one nickel salt, at least one chloride ion source, and at least one of a solvent or a pH buffer solution,
wherein the at least one chloride ion source is nickel chloride, hydrochloric acid, sodium chloride or potassium chloride,
wherein the at least one nickel salt is selected from the group consisting of nickel chloride, nickel sulfate, and nickel acetate,
wherein the at least one nickel salt and the at least one chloride ion source can both be nickel chloride,
wherein the at least one nickel salt is at least the nickel sulfate and the nickel sulfate is contained in an amount of 0.900 to 0.949 mol/l,
wherein a concentration of nickel ions is 0.1 to 8 mol/l, and
wherein a concentration of chloride ions is 0.01 to 0.02 mol/l.

10. The solution according to claim 9 , wherein the solution has a pH level of 3 to 3.5.

11. The solution according to claim 9 , wherein the solution has a pH level of 2.5 to 3.5.

12. The solution according to claim 9 , wherein the at least one nickel salt is the nickel chloride, the nickel sulfate and the nickel acetate.

13. The solution according to claim 9 , wherein the pH buffer solution is acetic acid-nickel acetate buffer solution or a succinic acid-nickel succinate buffer solution.

Assignees

• Toyota Motor Co Ltd

Inventors

• Sato Yuki

Classifications

• C25D3/12 Primary

  of nickel or cobalt · CPC title

• C25D5/06

  Brush or pad plating · CPC title

• B32B15/017

  one layer being formed of aluminium or an aluminium alloy, another layer being formed of an alloy based on a non ferrous metal other than aluminium · CPC title

• B32B2255/205

  Metallic coating · CPC title

• C25D5/028

  one side electroplating, e.g. substrate conveyed in a bath with inhibited background plating · CPC title