Substrate treatment method and substrate treatment equipment

Patent metadata

Field	Value
Publication number	US-2016233082-A1
Application number	US-201415023161-A
Country	US
Kind code	A1
Filing date	Sep 17, 2014
Priority date	Sep 25, 2013
Publication date	Aug 11, 2016
Grant date	—

Abstract

Provided are a substrate treatment method and a substrate treatment equipment enabling greater suppression of corrosion or oxidation of metal wiring exposed on a substrate surface. The present invention relates to a substrate treatment equipment having a treatment chamber wherein a substrate is disposed, and whereto a substrate treatment solution for treating the substrate is supplied. This equipment is provided with an inert gas filling mechanism for filling with an inert gas the interior of the treatment chamber wherein the substrate is disposed, and, near or inside the treatment chamber, a catalytic unit filled with a platinum-group metal catalyst wherethrough a hydrogen-dissolved water including hydrogen added to ultra-pure water is passed. Obtained by passing the hydrogen-dissolved water through the platinum-group metal catalyst, a hydrogen-dissolved treatment solution is supplied as the substrate treatment solution into the treatment chamber by the equipment.

First claim

1 - 16 . (canceled)

17 . A substrate treatment equipment comprising:
a treatment chamber in which a substrate is to be disposed and to which a substrate treatment solution for treating the substrate is to be supplied; an inert gas filling mechanism configured to fill an inert gas in the treatment chamber having the substrate disposed therein, and a catalytic unit provided near the treatment chamber or in the treatment chamber, and filled with a platinum-group metal catalyst through which a hydrogen-dissolved solution prepared by adding hydrogen to a solution to be treated is to be passed, wherein a hydrogen-dissolved treatment solution obtained by passing the hydrogen-dissolved solution through the platinum-group metal catalyst is supplied as the substrate treatment solution into the treatment chamber.

18 . The substrate treatment equipment according to claim 17 ,
wherein a concentration of dissolved hydrogen in the hydrogen-dissolved solution is 8 μg/L or higher, wherein the inert gas filling mechanism is configured to fill the treatment chamber with the inert gas so that a concentration of oxygen gas in the treatment chamber is 2% or less, and wherein the catalytic unit is configured to adjust a concentration of dissolved oxygen to 2 μg/L or less and a concentration of hydrogen peroxide to 2 μg/L or less in the hydrogen-dissolved treatment solution.

19 . The substrate treatment equipment according to claim 17 , wherein the treatment chamber is provided with a substrate holding mechanism configured to hold at least the substrate and a treatment solution nozzle configured to supply the substrate treatment solution to the substrate held by the substrate holding mechanism.

20 . The substrate treatment equipment according to claim 19 , comprising a shield member having a substrate facing surface facing the substrate held by the substrate holding mechanism,
wherein the treatment solution nozzle and the inert gas filling mechanism are provided for the shield member, so that the substrate treatment solution and the inert gas can be supplied to a space between the substrate held by the substrate holding mechanism and the substrate facing surface of the shield member.

21 . The substrate treatment equipment according to claim 17 , wherein the treatment chamber is provided with a treatment tank in which at least the substrate is disposed and a treatment solution nozzle configured to supply the substrate treatment solution into the treatment tank.

22 . The substrate treatment equipment according to claim 17 , wherein a pipe configured to supply the substrate treatment solution into the treatment chamber comprises an inner pipe through which the substrate treatment solution passes and an outer pipe configured to surround the inner pipe, and
further comprising a unit configured to supply the inert gas to a space between the inner pipe and the outer pipe.

23 . The substrate treatment equipment according to claim 17 , further comprising a chemical solution preparation unit configured to prepare a dilute chemical solution by injecting a chemical solution into a pipe configured to supply the substrate treatment solution into the treatment chamber and mixing the chemical solution and the substrate treatment solution in the pipe.

24 . The substrate treatment equipment according to claim 23 , further comprising a chemical solution tank configured to store therein the chemical solution and a unit configured to supply the inert gas into the chemical solution tank.

25 . The substrate treatment equipment according to claim 17 , comprising a chemical solution dilution tank into which a chemical solution and the substrate treatment solution are supplied to dilute the substrate treatment solution with the chemical solution, and configured to supply a dilute chemical solution obtained by diluting the substrate treatment solution with the chemical solution into the treatment chamber.

26 . The substrate treatment equipment according to claim 25 , further comprising a unit configured to supply the inert gas into the chemical solution dilution tank.

27 . The substrate treatment equipment according to claim 25 , wherein a pipe configured to supply the dilute chemical solution into the treatment chamber comprises an inner pipe through which the dilute chemical solution passes and an outer pipe configured to surround the inner pipe, and
further comprising a unit configured to supply the inert gas to a space between the inner pipe and the outer pipe.

28 . The substrate treatment equipment according to claim 17 , wherein the platinum-group meal catalyst is a palladium catalyst.

29 . The substrate treatment equipment according to claim 17 , wherein the platinum-group metal catalyst is obtained as a result of supporting a palladium catalyst on a monolithic organic porous anion exchanger.

30 . The substrate treatment equipment according to claim 17 , wherein the substrate that is to be treated by the substrate treatment solution is a substrate of which a single body of any one element or a compound of at least copper, molybdenum and tungsten is exposed on a surface thereof.

31 . The substrate treatment equipment according to claim 17 , wherein the solution to be treated is ultrapure water.

32 . A catalytic unit being disposed near the treatment chamber or in the treatment chamber of the substrate treatment equipment according to claim 17 and having a platinum-group metal catalyst filled therein, wherein a hydrogen-dissolved treatment solution obtained by passing a hydrogen-dissolved solution through the platinum-group metal catalyst is supplied as a substrate treatment solution into the treatment chamber.

Assignees

• Organo Corp

Inventors

• Yano Daisaku
• Yamashita Yukinari
• Murayama Masami
• Yamanaka Koji

Classifications

• H10P72/0426

  with the semiconductor substrates being dipped in baths or vessels · CPC title

• H10P72/0424

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0402

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• H10P70/273

  the processing being a delineation of conductive layers, e.g. by RIE · CPC title