Substrate processing apparatus, substrate processing method, and chemical liquid
US-12371796-B2 · Jul 29, 2025 · US
Treatment of copper or alloys based thereon
Treatment of copper or alloys based thereon · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23C22/63 |
| Official title | Treatment of copper or alloys based thereon |
| Display label | Treatment of copper or alloys based thereon |
| Total patents | 30 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2016 | 2 |
| 2017 | 2 |
| 2018 | 4 |
| 2019 | 4 |
| 2020 | 1 |
| 2021 | 4 |
| 2023 | 4 |
| 2024 | 2 |
| 2025 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Photothermal evaporator for a desalination system and method of manufacture
US-12357923-B2 · Jul 15, 2025 · US
Composite copper components
US-12336116-B2 · Jun 17, 2025 · US
Patinated or patina-ready metal transaction cards and manufacturing processes
US-12208599-B2 · Jan 28, 2025 · US
Fastener member
US-12188131-B2 · Jan 7, 2025 · US
Passivation of copper-nickel alloy conduits for marine use
US-12084775-B1 · Sep 10, 2024 · US
Method for manufacturing laminate
US-2024179848-A1 · May 30, 2024 · US
Composite copper foil
US-11781236-B2 · Oct 10, 2023 · US
Composite copper components
US-2023142375-A1 · May 11, 2023 · US
Substrate processing apparatus, substrate processing method, and chemical liquid
US-2023041889-A1 · Feb 9, 2023 · US
Substrate processing apparatus, substrate processing method, and chemical liquid
US-11545367-B2 · Jan 3, 2023 · US
Fastener Member
US-2021388505-A1 · Dec 16, 2021 · US
Substrate processing apparatus, substrate processing method, and chemical liquid
US-2021233780-A1 · Jul 29, 2021 · US
Patinated or patina-ready metal transaction cards and manufacturing processes
US-2021162700-A1 · Jun 3, 2021 · US
Patinated or patina-ready metal transaction cards and manufacturing process
US-10946611-B2 · Mar 16, 2021 · US
Composite copper foil
US-2020332431-A1 · Oct 22, 2020 · US
Methods of treating metal surfaces and devices formed thereby
US-10375835-B2 · Aug 6, 2019 · US
Roughened copper foil, copper clad laminate, and printed circuit board
US-10280501-B2 · May 7, 2019 · US
Production method for copper-clad laminate plate
US-10244635-B2 · Mar 26, 2019 · US
Anti-bacterial patterned surfaces and methods of making the same
US-2019037841-A1 · Feb 7, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23C22/63?
- CPC C23C22/63 is the Cooperative Patent Classification code for “Treatment of copper or alloys based thereon.”
- How many patents are filed under CPC C23C22/63 (Treatment of copper or alloys based thereon)?
- Our database includes 30 publications tagged with this CPC code.
- Is patent activity under CPC C23C22/63 growing?
- Publication counts under this code: 2 in 2024 vs 5 in 2025 (latest complete years).