Production method for copper-clad laminate plate

Patent metadata

Field	Value
Publication number	US-10244635-B2
Application number	US-201715570846-A
Country	US
Kind code	B2
Filing date	Jan 31, 2017
Priority date	Mar 3, 2016
Publication date	Mar 26, 2019
Grant date	Mar 26, 2019

Abstract

There is provided a method of producing a copper clad laminate having a copper foil and a resin bonded at high adhesive force despite the use of a thermoplastic resin having a low dielectric constant. This method includes the steps of: providing a roughened copper foil having at least one roughened surface having fine irregularities composed of acicular crystals containing cupric oxide and cuprous oxide; and bonding a sheet-shaped thermoplastic resin to the roughened surface of the roughened copper foil to provide a copper clad laminate. The roughened surface has a cupric oxide thickness of 1 to 20 nm and a cuprous oxide thickness of 15 to 70 nm, both determined by sequential electrochemical reduction analysis (SERA) at the time of bonding the thermoplastic resin.

First claim

The invention claimed is:

1. A method of producing a copper clad laminate, comprising:
providing a roughened copper foil having at least one roughened surface having irregularities composed of acicular crystals containing cupric oxide and cuprous oxide, and
bonding a sheet-shaped thermoplastic resin to the roughened surface of the roughened copper foil to provide a copper clad laminate,
wherein the roughened surface has a cupric oxide thickness of 1 to 20 nm and a cuprous oxide thickness of 15 to 70 nm, both determined by sequential electrochemical reduction analysis (SERA) at the time of bonding the thermoplastic resin.

2. The method according to claim 1 , wherein the acicular crystals have a height of 50 to 400 nm.

3. The method according to claim 1 , wherein the thermoplastic resin is at least one resin selected from the group consisting of polysulfones, polyethersulfones, amorphous polyarylates, liquid crystal polymers, polyether ether ketones, thermoplastic polyimides, polyamide-imides, fluororesins, polyamides, nylons, polyacetals, modified polyphenylene ethers, polyethylene terephthalate, glass fiber reinforced polyethylene terephthalate, and cycloolefins.

4. The method according to claim 1 , wherein the thermoplastic resin is at least one resin selected from the group consisting of polysulfones, polyethersulfones, amorphous polyarylates, liquid crystal polymers, polyether ether ketones, thermoplastic polyimides, polyamide-imides, and fluororesins.

5. The method according to claim 1 , wherein the thermoplastic resin is a fluororesin, and the fluororesin is at least one selected from the group consisting of polytetrafluoroethylene, tetrafluoroethylene-perfluoroalkylvinylether copolymers, tetrafluoroethylene-hexafluoropropylene copolymers, and tetrafluoroethylene-ethylene copolymers.

6. The method according to claim 1 , wherein the roughened copper foil has an organic rust-proof layer on the roughened surface.

7. The method according to claim 6 , wherein the organic rust-proof layer contains at least one of a triazole compound and a silane coupling agent.

8. The method according to claim 6 , wherein the organic rust-proof layer comprises a triazole compound.

Assignees

• Mitsui Mining & Smelting Co

Inventors

• Tateoka Ayumu
• Hosokawa Makoto
• Kawaguchi Shota

Classifications

• B32B17/061

  of metal · CPC title

• B32B38/0012

  Mechanical treatment, e.g. roughening, deforming, stretching · CPC title

• H05K2203/0307

  Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites · CPC title

• B32B2307/732

  Dimensional properties · CPC title

• H05K3/022 Primary

  Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates · CPC title