Method for coating metallic surfaces with a composition that is rich in polymers
US-2015361274-A1 · Dec 17, 2015 · US
Roughened copper foil, copper clad laminate, and printed circuit board
US10280501B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10280501-B2 |
| Application number | US-201615528872-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 6, 2016 |
| Priority date | Sep 30, 2015 |
| Publication date | May 7, 2019 |
| Grant date | May 7, 2019 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
There is provided a roughened copper foil which can significantly improve adhesion to an insulating resin and reliability (e.g., hygroscopic heat resistance). The roughened copper foil of the present invention has at least one roughened surface having fine irregularities composed of acicular crystals, wherein the entire surface of the acicular crystals is composed of a mixed phase of Cu metal and Cu 2 O.
First claim
Opening claim text (preview).
The invention claimed is: 1. A roughened copper foil having at least one roughened surface having fine irregularities consisting of acicular crystals, wherein an entire surface of the acicular crystals consists of a mixed phase of Cu metal and Cu 2 O having a thickness of 10 nm or less, and the interior of the acicular crystals consists of a single phase of Cu metal. 2. The roughened copper foil according to claim 1 , wherein a height of the acicular crystal is in a range of 50 to 400 nm. 3. The roughened copper foil according to claim 1 , wherein the fine irregularities are formed through oxidation-reduction treatment. 4. A copper clad laminate comprising the roughened copper foil according to claim 1 . 5. A printed circuit board comprising the roughened copper foil according to claim 1 .
Assignees
Inventors
Classifications
with at least one oxide layer · CPC title
After-treatment · CPC title
Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates · CPC title
Oxidising metal · CPC title
of copper · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US10280501B2 cover?
- There is provided a roughened copper foil which can significantly improve adhesion to an insulating resin and reliability (e.g., hygroscopic heat resistance). The roughened copper foil of the present invention has at least one roughened surface having fine irregularities composed of acicular crystals, wherein the entire surface of the acicular crystals is composed of a mixed phase of Cu metal a…
- Who is the assignee on this patent?
- Mitsui Mining & Smelting Co
- What technology area does this patent fall under?
- Primary CPC classification C23C22/83. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue May 07 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).