Composite copper foil

Patent metadata

Field	Value
Publication number	US-11781236-B2
Application number	US-201816762587-A
Country	US
Kind code	B2
Filing date	Nov 9, 2018
Priority date	Nov 10, 2017
Publication date	Oct 10, 2023
Grant date	Oct 10, 2023

Abstract

[Problem] An object is to provide novel composite copper foils. [Means to solve the problem] A composite copper foil comprises a copper foil and a layer of metal other than copper, the metal layer being formed on at least a part of a surface of the copper foil, wherein at least a part of the composite copper foil has protrusions on a surface thereof, and each protrusion has a height of 10 nm or more but 1000 nm or less in a cross-section of the composite copper foil.

First claim

The invention claimed is:

1. A composite copper foil comprising a copper foil and a layer of metal other than copper, the metal layer being formed on at least a part of a surface of the copper foil, wherein
at least a part of the composite copper foil has protrusions on a surface thereof,
each protrusion has a height of 10 nm or more but 1000 nm or less in a cross-section of the composite copper foil,
the metal layer is formed on at least a part of a surface of the protrusions of the copper foil,
a number of protrusions with a height of 50 nm or more is, on average, 15 or more and 100 or less per a 3.8-μm range of a cross-section of the composite copper foil, and
arithmetic average roughness (Ra) of the protrusions is 0.02 μm or more and 0.20 μm or less.

2. The composite copper foil according to claim 1 , wherein a percentage of Cu relative to the total weight of Cu and the metal other than Cu at a depth of 6 nm in the composite foil is 80% or less and a percentage of Cu relative to the total weight of Cu and the metal other than Cu at a depth with no oxygen is 90% or more.

3. The composite copper foil according to claim 2 , wherein each protrusion has a height of 50 nm or more but 500 nm or less.

4. The composite copper foil according to claim 2 , wherein the layer of metal is a uniform layer with no particles.

5. The composite copper foil according to claim 2 , wherein a Cu/O ratio at a depth where the atomic percentage of Cu is 40% is 0.9 or more.

6. The composite copper foil according to claim 1 , wherein each protrusion has a height of 50 nm or more but 500 nm or less.

7. The composite copper foil according to claim 1 , wherein the height of each protrusion is measured as a distance between a midpoint of a line segment connecting the lowest points of depressions on both sides of a given protrusion and the highest point of the protrusion, in a scanning electron microscope image of a cross-section.

8. The composite copper foil according to claim 1 , wherein the layer of metal is a uniform layer with no particles.

9. The composite copper foil according to claim 1 , wherein a Cu/O ratio at a depth where the atomic percentage of Cu is 40% is 0.9 or more.

10. The composite copper foil according to claim 1 , wherein the metal other than copper is at least one metal selected from the group consisting of Sn, Ag, Zn, Al, Ti, Bi, Cr, Fe, Co, Ni, Pd, Au, and Pt.

Assignees

• Namics Corp

Inventors

• Sato Makiko
• Suzuki Osamu
• Obata Naoki
• Kokaji Yoshinobu

Classifications

• C25D7/06 Primary

  Wires; Strips; Foils · CPC title

• C23C18/18

  Pretreatment of the material to be coated · CPC title

• C23C22/52

  Treatment of copper or alloys based thereon · CPC title

• C25D5/34

  Pretreatment of metallic surfaces to be electroplated · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title