Composite copper components

Patent metadata

Field	Value
Publication number	US-12336116-B2
Application number	US-202017771101-A
Country	US
Kind code	B2
Filing date	Oct 22, 2020
Priority date	Oct 25, 2019
Publication date	Jun 17, 2025
Grant date	Jun 17, 2025

Abstract

The present invention is directed to provide novel composite copper components. For example, provided is a composite copper component including a copper oxide-containing layer formed on at least a portion of the surface of a copper component, in which when the surface of the composite copper component is bonded to a resin substrate by thermocompression, and the copper component is peeled off from the resin substrate after the thermocompression bonding, metal contained in the copper oxide-containing layer is transferred to the resin substrate.

First claim

The invention claimed is:

1. A composite copper component comprising a copper oxide-containing layer formed on at least a portion of the surface of a copper component, wherein
when the surface of the composite copper component is bonded to a resin substrate by thermocompression under given conditions, and the copper component is peeled off from the resin substrate under given conditions after the thermocompression bonding, a metal atom contained in the copper oxide-containing layer is detected from a surface of the resin substrate from which the copper component has been peeled off in an X-ray photoelectron spectrum obtained by an X-ray photoelectron spectroscopy (XPS) analysis with a survey spectrum, and
wherein a sum of intensities of main peaks of metal elements detected from the surface of the resin substrate from which the copper component has been peeled off is greater than a peak intensity of C1s.

2. The composite copper component according to claim 1 , wherein [a sum of percentages of metal elements in surface atomic composition (atom %)] divided by [a percentage of C1s in surface atomic composition (atom %)], calculated from a result of XPS measurement, on the surface of the resin substrate from which the copper component has been peeled off, is 0.040 or more.

3. The composite copper component according to claim 2 , wherein [a sum of percentages of metal elements in surface atomic composition (atom %)] divided by [a percentage of C1s in surface atomic composition (atom %)], calculated from a result of XPS measurement, on the surface of the resin substrate from which the copper component has been peeled off, is 0.010 or more.

4. The composite copper component according to claim 3 , wherein a sum of percentages of Cu2p3 and Ni2p3 in surface atomic composition is 3.0 atom % or more when an XPS analysis with a survey spectrum is performed on the surface of the resin substrate from which the copper component has been peeled off, and percentages of detected elements are calculated.

5. The composite copper component according to claim 3 , wherein a sum of percentages of Cu2p3 and Ni2p3 in surface atomic composition is 1.5 atom % or more when an XPS analysis with a survey spectrum is performed on the surface of the resin substrate from which the copper component has been peeled off, and percentages of detected elements are calculated.

6. The composite copper component according to claim 1 , wherein a percentage of Cu2p3 in surface atomic composition is 2.8 atom % or more when an XPS analysis with a survey spectrum is performed on the surface of the resin substrate from which the copper component has been peeled off, and percentages of detected elements are calculated.

7. The composite copper component according to claim 1 , wherein a percentage of Cu2p3 in surface atomic composition is 1.0 atom % or more when an XPS analysis with a survey spectrum is performed on the surface of the resin substrate from which the copper component has been peeled off, and percentages of detected elements are calculated.

8. The composite copper component according to claim 1 , wherein the surface of the composite copper component with the copper oxide-containing layer formed thereon has an arithmetic mean roughness (Ra) of 0.04 μm or more, and a percentage of Ra of the surface of the copper component peeled off from the resin substrate to the Ra of the surface of the composite copper component is less than 100%.

9. The composite copper component according to claim 1 , wherein a percentage of a surface area of the copper component peeled off from the resin substrate to a surface area of the surface of the composite copper component with the copper oxide-containing layer formed thereon is less than 100%.

10. The composite copper component according to claim 1 , wherein a color difference (AE*ab) between the surface of the composite copper component with the copper oxide-containing layer formed thereon and the surface of the copper component peeled off from the resin substrate is 15 or more.

11. The composite copper component according to claim 1 , wherein the resin substrate contains at least one insulating resin selected from the group consisting of polyphenylene ethers (PPEs), epoxy resins, polyphenylene oxides (PPOs), polybenzoxazoles (PBOs), polytetrafluoroethylenes (PTFEs), liquid crystal polymers (LCPs), or triphenylphosphites (TPPIs), fluoropolymers, polyetherimides, polyetheretherketones, polycycloolefins, bismaleimide resins, low dielectric constant polyimides, and cyanate resins.

12. The composite copper component according to claim 1 , wherein given conditions for the thermocompression bonding are at a temperature from 50 to 400° C., at a pressure from 0 to 20 MPa, and for a time from 1 minute to 5 hours.

13. The composite copper component according to claim 1 , wherein the copper oxide-containing layer contains metal other than copper.

14. The composite copper component according to claim 13 , wherein the metal other than copper is nickel.

15. A method of manufacturing a printed wiring board using a composite copper component according to claim 1 , the method comprising the steps of:
1) bonding a resin substrate to a copper oxide-containing layer of the composite copper component under given conditions by thermocompression;
2) peeling off the copper component from the resin substrate under given conditions to obtain a resin substrate having a part or all of metal constituting the copper oxide-containing layer; and
3) Plating copper on the surface of the resin substrate having the part or all of metal constituting the copper oxide-containing layer.

Assignees

• Namics Corp

Inventors

• Obata Naoki
• Kokaji Yoshinobu
• Sato Makiko

Classifications

• H05K2203/124

  Heterocyclic organic compounds, e.g. azole, furan · CPC title

• H05K2203/0796

  Oxidant in aqueous solution, e.g. permanganate · CPC title

• H05K2203/0315

  Oxidising metal · CPC title

• H05K2201/0355

  Metal foils · CPC title

• H05K3/389

  by the use of a coupling agent, e.g. silane · CPC title