Device for Printing to a Recording Medium
US-2025034716-A1 · Jan 30, 2025 · US
with use of metal first
with use of metal first · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23C18/1841 |
| Official title | {with use of metal first} |
| Display label | with use of metal first |
| Total patents | 47 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 5 |
| 2016 | 6 |
| 2017 | 4 |
| 2018 | 4 |
| 2019 | 4 |
| 2020 | 6 |
| 2021 | 6 |
| 2022 | 3 |
| 2023 | 6 |
| 2024 | 2 |
| 2025 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Laminated film structure and method for manufacturing laminated film structure
US-12069809-B2 · Aug 20, 2024 · US
Substrate processing method, substrate processing apparatus, and recording medium
US-2024200195-A1 · Jun 20, 2024 · US
Laminated film structure and method for manufacturing laminated film structure
US-2023389189-A1 · Nov 30, 2023 · US
Laminated film structure and method for manufacturing laminated film structure
US-11825608-B2 · Nov 21, 2023 · US
Composite copper foil
US-11781236-B2 · Oct 10, 2023 · US
Process for metallization of electrochemically active powders
US-11682758-B2 · Jun 20, 2023 · US
Metal displacement solution, method for surface treatment of aluminum or aluminum alloy
US-2023151493-A1 · May 18, 2023 · US
Laminated film structure and method for manufacturing laminated film structure
US-2023156924-A1 · May 18, 2023 · US
Method for fabricating electronic component
US-2022396881-A1 · Dec 15, 2022 · US
Semiconductor substrate and manufacturing method therefor
US-11251145-B2 · Feb 15, 2022 · US
Plating method, plating apparatus and recording medium
US-11230767-B2 · Jan 25, 2022 · US
Plating method, plating apparatus and recording medium
US-2021175079-A1 · Jun 10, 2021 · US
Electroless copper plating and counteracting passivation
US-2021140051-A1 · May 13, 2021 · US
Electroless copper plating and counteracting passivation
US-2021140052-A1 · May 13, 2021 · US
Plating method, plating apparatus and recording medium
US-2021115565-A1 · Apr 22, 2021 · US
Plating method, plating system, and recording medium
US-2021108316-A1 · Apr 15, 2021 · US
Film formation method
US-10941493-B2 · Mar 9, 2021 · US
Semiconductor substrate and manufacturing method therefor
US-2020357758-A1 · Nov 12, 2020 · US
Composite copper foil
US-2020332431-A1 · Oct 22, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23C18/1841?
- CPC C23C18/1841 is the Cooperative Patent Classification code for “with use of metal first.”
- How many patents are filed under CPC C23C18/1841 (with use of metal first)?
- Our database includes 47 publications tagged with this CPC code.
- Is patent activity under CPC C23C18/1841 growing?
- Publication counts under this code: 2 in 2024 vs 1 in 2025 (latest complete years).