Laminated film structure and method for manufacturing laminated film structure

Patent metadata

Field	Value
Publication number	US-11825608-B2
Application number	US-202017914961-A
Country	US
Kind code	B2
Filing date	Dec 24, 2020
Priority date	Jun 30, 2020
Publication date	Nov 21, 2023
Grant date	Nov 21, 2023

Abstract

A method for forming a metal film includes forming an oxide layer on a to-be-treated surface of a to-be-treated object by bringing the to-be-treated surface into contact with a reaction solution containing fluorine and an oxide precursor, removing fluorine in the oxide layer, supporting a catalyst on the oxide layer by bringing the oxide layer into contact with a catalyst solution, and depositing a metal film on the oxide layer by bringing the oxide layer into contact with an electroless plating liquid.

First claim

The invention claimed is:

1. A laminated film structure comprising:
a to-be-treated object, the to-be-treated object being made of an insulator or an insulator having a conductive layer formed on a surface thereof in advance; and
an oxide layer formed on a surface of the to-be-treated object;
a catalyst layer provided on the oxide layer; and
a metal layer provided on the catalyst layer,

wherein a fluorine content of the oxide layer is 0.01% by mass or more and 1.0% by mass or less.

2. The laminated film structure according to claim 1 , wherein an element type contained in the oxide layer is at least one type selected from titanium, silicon, tin, zirconium, zinc, nickel, indium, vanadium, chromium, manganese, iron, cobalt, and copper.

3. The laminated film structure according to claim 1 , wherein the catalyst layer contains at least one type of element selected from gold, palladium, and silver.

4. The laminated film structure according to claim 3 , wherein a second metal layer is formed on the metal layer.

5. The laminated film structure according to claim 1 , wherein the metal layer contains at least one type of nickel or cupper.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Shimada Kazuya
• Hayamizu Masahito
• Sakata Toshihiko
• Chakuno Makoto

Classifications

• H05K3/022 Primary

  Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates · CPC title

• C23C28/322

  only coatings of metal elements only · CPC title

• H05K3/422

  characterised by electroless plating method; pretreatment therefor · CPC title

• H05K3/426

  initial plating of through-holes in substrates without metal · CPC title

• H05K3/427

  initial plating of through-holes in metal-clad substrates · CPC title