Laminated film structure and method for manufacturing laminated film structure

Patent metadata

Field	Value
Publication number	US-12069809-B2
Application number	US-202318205318-A
Country	US
Kind code	B2
Filing date	Jun 2, 2023
Priority date	Jun 30, 2020
Publication date	Aug 20, 2024
Grant date	Aug 20, 2024

Abstract

Method for forming a metal film includes forming an oxide layer on a to-be-treated surface of a to-be-treated object by bringing the to-be-treated surface into contact with a reaction solution containing fluorine and an oxide precursor, removing fluorine in the oxide layer, supporting a catalyst on the oxide layer by bringing the oxide layer into contact with a catalyst solution, and depositing a metal film on the oxide layer by bringing the oxide layer into contact with an electroless plating liquid.

First claim

What is claimed is:

1. A method for manufacturing a laminated film structure comprising:
forming an oxide layer on a to-be-treated surface of a to-be-treated object by bringing the to-be-treated surface into contact with a reaction solution containing fluorine and an oxide precursor, the to-be-treated object being made of an insulator or an insulator having a conductive layer formed on the surface thereof in advance;
removing fluorine in the oxide layer;
forming a catalyst layer by bringing the oxide layer into contact with a catalyst liquid; and
forming a metal film on the catalyst layer by an electroless plating method.

2. The method for manufacturing the laminated film structure according to claim 1 , wherein the oxide precursor includes at least one type or more elements selected from titanium, silicon, tin, zirconium, zinc, nickel, indium, vanadium, chromium, manganese, iron, cobalt, and copper.

3. The method for manufacturing the laminated film structure according to claim 1 , wherein the reaction solution includes at least one type of a boric acid salt, an aluminum salt, and hydrogen peroxide.

4. The method for manufacturing the laminated film structure according to claim 1 , wherein the catalyst liquid contains at least one type of element selected from gold, palladium, and silver.

5. The method for manufacturing the laminated film structure according to claim 1 , further comprising forming a second metal layer on the metal layer by an electrolytic plating method.

6. The method for manufacturing the laminated film structure according to claim 1 , wherein the metal layer formed by the electroless plating method contains at least one type of element selected from nickel and copper.

7. The method for manufacturing the laminated film structure according to claim 1 , wherein:
a thickness of the oxide layer is 200 nm or more; and
the fluorine removal includes
annealing the oxide layer at 100° C. or higher and 150° C. or lower, and
bringing the oxide layer into contact with an alkali solution with a pH of 10.5 or higher, after the annealing.

8. The method for manufacturing the laminated film structure according to claim 1 , wherein:
a thickness of the oxide layer is less than 200 nm;
the oxide layer is formed of an amphoteric oxide; and
the fluorine removal includes any of:
annealing the oxide layer at 150° C. or higher; or
annealing the oxide layer at 100° C. or higher and 150° C. or lower, and
bringing the oxide layer into contact with an alkali solution with a pH of 10.5 or higher, after the annealing.

9. The method for manufacturing the laminated film structure according to claim 1 , wherein:
a thickness of the oxide layer is less than 200 nm;
the oxide layer is formed of a material other than an amphoteric oxide; and
the fluorine removal includes any of:
annealing the oxide layer at 150° C. or higher; or
bringing the oxide layer into contact with an alkali solution with a pH of 10.5 or higher.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Shimada Kazuya
• Hayamizu Masahito
• Sakata Toshihiko
• Chakuno Makoto

Classifications

• Y10T428/12611

  Oxide-containing component · CPC title

• H05K2203/0723

  Electroplating, e.g. finish plating · CPC title

• H05K2203/072

  Electroless plating, e.g. finish plating or initial plating · CPC title

• H05K2203/0716

  Metallic plating catalysts, e.g. for direct electroplating of through holes; Sensitising or activating metallic plating catalysts · CPC title

• H05K3/427

  initial plating of through-holes in metal-clad substrates · CPC title