Plating method, plating apparatus and recording medium

Patent metadata

Field	Value
Publication number	US-11230767-B2
Application number	US-201716345320-A
Country	US
Kind code	B2
Filing date	Aug 29, 2017
Priority date	Oct 27, 2016
Publication date	Jan 25, 2022
Grant date	Jan 25, 2022

Abstract

A substrate W having a non-plateable material portion 31 and a plateable material portion 32 formed on a surface thereof is prepared, and then, a catalyst is selectively imparted to the plateable material portion 32 by performing a catalyst imparting processing on the substrate W. Thereafter, a plating layer 35 is selectively formed on the plateable material portion 32 by supplying a plating liquid M 1 onto the substrate W. The plating liquid M 1 contains an inhibitor which suppresses the plating layer 35 from being precipitated on the non-plateable material portion 31.

First claim

We claim:

1. A plating method, comprising:
preparing a substrate having a non-plateable material portion and a plateable material portion formed on a surface of the substrate;
imparting a catalyst selectively to the plateable material portion by performing a catalyst imparting processing on the substrate; and
forming a plating layer selectively on the plateable material portion by supplying a plating liquid onto the substrate in a state that the plateable material portion and the non-plateable material portion are exposed at the surface of the substrate,
wherein the plating liquid contains an inhibitor which suppresses the plating layer from being precipitated on the non-plateable material portion,
the catalyst imparting processing is performed by supplying, onto the substrate, a catalyst solution containing a metal catalyst in a form of nanoparticles and a polyvinylpyrrolidone (PVP) as a dispersant for dispersing the metal catalyst in the catalyst solution, and
the non-plateable material portion is made of a material containing SiO 2 as a main component.

2. The plating method of claim 1 ,
wherein the inhibitor is bis(3-sulfopropyl)disulfide (SPS) or polymer having an amino group.

3. The plating method of claim 1 ,
wherein the substrate includes a base member made of the plateable material portion and a core member which is protruded from the base member and is made of the non-plateable material portion.

4. The plating method of claim 1 ,
wherein the plateable material portion is made of a material containing at least one of an OCH x group or a NH x group, a material containing Si as a main component, a material containing a catalyst metal material as a main component, or a material containing carbon as a main component.

Assignees

• Tokyo Electron Ltd

Inventors

• Inatomi Yuichiro
• Tanaka Takashi
• IWAI Kazutoshi

Classifications

• H10P14/46

  using a liquid · CPC title

• H10P76/4085

  characterised by the processes involved to create the masks · CPC title

• C23C18/1635 Primary

  Composition of the substrate · CPC title

• H05K3/18

  using precipitation techniques to apply the conductive material · CPC title

• C23C18/1889

  with use of metal first · CPC title