Method of fabricating and coating copper nanowires
US-2022056587-A1 · Feb 24, 2022 · US
with two steps starting with addition of reducing agent followed by metal deposition
with two steps starting with addition of reducing agent followed by metal deposition · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23C18/166 |
| Official title | {with two steps starting with addition of reducing agent followed by metal deposition} |
| Display label | with two steps starting with addition of reducing agent followed by metal deposition |
| Total patents | 68 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 13 |
| 2016 | 14 |
| 2017 | 9 |
| 2018 | 5 |
| 2019 | 8 |
| 2020 | 3 |
| 2021 | 7 |
| 2022 | 2 |
| 2023 | 3 |
| 2024 | 3 |
| 2025 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method for producing printed wiring board
US-2021289637-A1 · Sep 16, 2021 · US
Manufacturing a package using plateable encapsulant
US-11081417-B2 · Aug 3, 2021 · US
Electroless copper plating and counteracting passivation
US-2021140051-A1 · May 13, 2021 · US
Metal-containing fabrics and membranes, and method of manufacturing thereof
US-2021144851-A1 · May 13, 2021 · US
Electroless copper plating and counteracting passivation
US-2021140052-A1 · May 13, 2021 · US
Method of manufacturing conductive laminate, conductive laminate, and touch sensor
US-11003297-B2 · May 11, 2021 · US
Plating method, plating apparatus and recording medium
US-2021115565-A1 · Apr 22, 2021 · US
Process for metallization of electrochemically active powders
US-2020328408-A1 · Oct 15, 2020 · US
Conductive laminate for touch panel, touch panel, and transparent conductive laminate
US-10619248-B2 · Apr 14, 2020 · US
Silver-coated particle and method of producing same
US-10590540-B2 · Mar 17, 2020 · US
Method of manufacturing conductive laminate, conductive laminate, and touch sensor
US-2019369812-A1 · Dec 5, 2019 · US
Electroless deposition of metal on 3D-printed polymeric structures
US-10494721-B1 · Dec 3, 2019 · US
Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate
US-2019345623-A1 · Nov 14, 2019 · US
Manufacturing a package using plateable encapsulant
US-2019341324-A1 · Nov 7, 2019 · US
Non-contact strain measurement
US-10402716-B2 · Sep 3, 2019 · US
Semiconductor package with plateable encapsulant and a method for manufacturing the same
US-10396007-B2 · Aug 27, 2019 · US
Fuel hose
US-2019162333-A1 · May 30, 2019 · US
Metal nanowire thin-films
US-10237974-B2 · Mar 19, 2019 · US
In-situ balancing of plated polymers
US-10049318-B2 · Aug 14, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23C18/166?
- CPC C23C18/166 is the Cooperative Patent Classification code for “with two steps starting with addition of reducing agent followed by metal deposition.”
- How many patents are filed under CPC C23C18/166 (with two steps starting with addition of reducing agent followed by metal deposition)?
- Our database includes 68 publications tagged with this CPC code.
- Is patent activity under CPC C23C18/166 growing?
- Publication counts under this code: 3 in 2024 vs 1 in 2025 (latest complete years).