In-situ balancing of plated polymers

US10049318B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10049318-B2
Application numberUS-201414903915-A
CountryUS
Kind codeB2
Filing dateJul 9, 2014
Priority dateJul 9, 2013
Publication dateAug 14, 2018
Grant dateAug 14, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for balancing a rotatable component is disclosed This method comprises and then plating the component to deposit a metal layer onto the component until the component is balanced. In addition, and alternative method for balancing a rotatable component is disclosed. This method comprises attaching a balancing weight to the rotatable component and rotating the component. This is followed by plating the component and the balancing weight to deposit a metal layer onto the balancing weight and the component until the component is balanced.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for balancing a rotatable component, the method comprising: rotating the component; and selectively plating the rotating component to deposit a metal layer onto the component until the component is balanced, wherein the plating is selected from the group consisting of brush plating and brush electroplating. 2. The method of claim 1 wherein the brush plating comprises a brush saturated with plating solution. 3. The method of claim 2 wherein the brush is selected from the group consisting of stainless steel or graphite. 4. The method of claim 3 wherein the brush is further wrapped with a cloth material that holds the plating solution and prevents direct contact with the component being plated. 5. The method of claim 1 wherein the brush electroplating comprises a brush saturated with plating solution. 6. The method of claim 5 wherein the brush is selected from the group consisting of stainless steel or graphite. 7. The method of claim 6 wherein the brush is further wrapped with a cloth material that holds the plating solution and prevents direct contact with the component being plated. 8. A method for balancing a rotatable component, the method comprising: attaching a balancing weight to the rotatable component; rotating the component; and selectively plating the rotating component and the balancing weight to deposit a metal layer onto the balancing weight and the component until the component is balanced, wherein the plating is selected from the group consisting of brush plating and brush electroplating. 9. The method of claim 8 wherein the brush plating comprises a brush saturated with plating solution. 10. The method of claim 9 wherein the brush is selected from the group consisting of stainless steel or graphite. 11. The method of claim 10 wherein the brush is further wrapped with a cloth material that holds the plating solution and prevents direct contact with the component being plated. 12. The method of claim 8 wherein the brush electroplating comprises a brush saturated with plating solution. 13. The method of claim 9 wherein the brush is selected from the group consisting of stainless steel or graphite. 14. The method of claim 10 wherein the brush is further wrapped with a cloth material that holds the plating solution and prevents direct contact with the part being plated. 15. The method of claim 8 wherein the balancing weight is selected from the group consisting of metals, metal powder filled resins and polymers. 16. A method for balancing a rotatable fan assembly, the method comprising: attaching a balancing weight to the fan assembly; rotating the fan assembly; and plating the fan assembly and the balancing weight to deposit a metal layer onto the balancing weight and fan assembly until the fan assembly is balanced, wherein the plating is selected from the group consisting of brush plating and brush electroplating. 17. The method of claim 16 wherein the balancing weight is selected from the group consisting of metals, metal powder filled resins and polymers.

Assignees

Inventors

Classifications

  • of plastics · CPC title

  • Liquid or visquous · CPC title

  • Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating · CPC title

  • Applying surface layers, e.g. coatings, decorative layers, printed layers, to articles during shaping, e.g. in-mould printing (moulding on preformed layers as inserts B29C70/68; applying fluent material to surfaces in general B05) · CPC title

  • including at least one metal alloy layer · CPC title

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What does patent US10049318B2 cover?
A method for balancing a rotatable component is disclosed This method comprises and then plating the component to deposit a metal layer onto the component until the component is balanced. In addition, and alternative method for balancing a rotatable component is disclosed. This method comprises attaching a balancing weight to the rotatable component and rotating the component. This is followed …
Who is the assignee on this patent?
United Technologies Corp
What technology area does this patent fall under?
Primary CPC classification G01N3/08. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Aug 14 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).