Plating a composite to enhance bonding of metallic components
US-2016369635-A1 · Dec 22, 2016 · US
Process of electroless plating
Process of electroless plating · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23C18/1633 |
| Official title | {Process of electroless plating} |
| Display label | Process of electroless plating |
| Total patents | 202 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 30 |
| 2016 | 44 |
| 2017 | 40 |
| 2018 | 29 |
| 2019 | 20 |
| 2020 | 17 |
| 2021 | 9 |
| 2022 | 2 |
| 2023 | 4 |
| 2024 | 5 |
| 2025 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Erosion and wear protection for composites and plated polymers
US-2016368238-A1 · Dec 22, 2016 · US
Thermoformable multilayer films and blister packs produced therefrom
US-9511914-B2 · Dec 6, 2016 · US
Method for forming conductor layer, and method for producing multilayer wiring substrate using same
US-2016353580-A1 · Dec 1, 2016 · US
Method for forming flexible transparent conductive film
US-9506148-B2 · Nov 29, 2016 · US
Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board
US-2016330845-A1 · Nov 10, 2016 · US
Method for the fabrication and transfer of graphene
US-2016318207-A1 · Nov 3, 2016 · US
Method of forming wiring pattern and etching apparatus for forming wiring pattern
US-2016289840-A1 · Oct 6, 2016 · US
Acoustic wave device and method for manufacturing the same
US-2016286311-A1 · Sep 29, 2016 · US
Method of electroless gold plating
US-2016265115-A1 · Sep 15, 2016 · US
Gold plate coated material
US-2016265114-A1 · Sep 15, 2016 · US
Vented plated polymer
US-2016251760-A1 · Sep 1, 2016 · US
Metallization of the wafer edge for optimized electroplating performance on resistive substrates
US-2016254222-A1 · Sep 1, 2016 · US
Metal wiring layer forming method, metal wiring layer forming apparatus, and recording medium
US-2016240436-A1 · Aug 18, 2016 · US
Electroless nickel plating bath
US-9399820-B2 · Jul 26, 2016 · US
Method of modifying a sample surface layer from a microscopic sample
US-2016199878-A1 · Jul 14, 2016 · US
Method of electroless gold plating
US-9388497-B2 · Jul 12, 2016 · US
Method for depositing a copper seed layer onto a barrier layer and copper plating bath
US-2016194760-A1 · Jul 7, 2016 · US
Photosensitive resin composition for projection exposure, photosensitive element, method for forming resist pattern, process for producing printed wiring board and process for producing lead frame
US-2016170299-A1 · Jun 16, 2016 · US
Metallization of the wafer edge for optimized electroplating performance on resistive substrates
US-9368340-B2 · Jun 14, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23C18/1633?
- CPC C23C18/1633 is the Cooperative Patent Classification code for “Process of electroless plating.”
- How many patents are filed under CPC C23C18/1633 (Process of electroless plating)?
- Our database includes 202 publications tagged with this CPC code.
- Is patent activity under CPC C23C18/1633 growing?
- Publication counts under this code: 5 in 2024 vs 2 in 2025 (latest complete years).