Method and apparatus for preparing coated particles
US-2016369405-A1 · Dec 22, 2016 · US
Method of electroless gold plating
US9388497B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9388497-B2 |
| Application number | US-201314414655-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 11, 2013 |
| Priority date | Jul 13, 2012 |
| Publication date | Jul 12, 2016 |
| Grant date | Jul 12, 2016 |
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Abstract
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There is provided a method of electroless gold plating, wherein the method includes a step of forming an underlying alloy layer on a base material and a step of forming a gold plate layer directly on the underlying alloy layer by means of electroless reduction plating using a cyanide-free gold plating bath, wherein the method is characterized in that the underlying alloy layer is formed of an M1-M2-M3 alloy (where M1 is at least one element selected from Ni, Fe, Co, Cu, Zn and Sn, M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and Ru, and M3 is at least one element selected from P and B).
First claim
Opening claim text (preview).
What is claimed is: 1. A method of electroless gold plating comprising: forming an underlying alloy layer on a base material; and forming a gold plate layer directly on the underlying alloy layer by means of electroless reduction plating using a cyanide-free gold plating bath, wherein the underlying alloy layer is formed of an M1-M2-M3 alloy, M1 is at least one element selected from Ni, Fe, Co, Cu, Zn and Sn, M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and Ru, and M3 is at least one element selected from P and B, and M1-M2-M3 alloy having 20 to 50 at. % of M1, 30 to 50 at. % of M2, and 20 to 30 at. % of M3. 2. The method as set forth in claim 1 , wherein the thickness of the underlying alloy layer is 0.01 to 1.0 μm. 3. The method as set forth in claim 1 , the thickness of the gold plate layer is 5 to 100 nm.
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Classifications
No layer or component greater than 5 mils thick · CPC title
Absolute thicknesses specified · CPC title
Thickness [relative or absolute] · CPC title
Containing 0.01-1.7% carbon [i.e., steel] · CPC title
Ni-base component · CPC title
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- What does patent US9388497B2 cover?
- There is provided a method of electroless gold plating, wherein the method includes a step of forming an underlying alloy layer on a base material and a step of forming a gold plate layer directly on the underlying alloy layer by means of electroless reduction plating using a cyanide-free gold plating bath, wherein the method is characterized in that the underlying alloy layer is formed of an M…
- Who is the assignee on this patent?
- Toyo Kohan Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification C23C18/42. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Jul 12 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).