Copper alloy with high strength and excellent processability in bending and process for producing copper alloy sheet
US-9976208-B2 · May 22, 2018 · US
with manganese as the next major constituent
with manganese as the next major constituent · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C22C9/05 |
| Official title | with manganese as the next major constituent |
| Display label | with manganese as the next major constituent |
| Total patents | 159 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 17 |
| 2016 | 23 |
| 2017 | 17 |
| 2018 | 12 |
| 2019 | 31 |
| 2020 | 18 |
| 2021 | 17 |
| 2022 | 2 |
| 2023 | 9 |
| 2024 | 5 |
| 2025 | 6 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Materials for near field transducers and near field transducers containing same
US-9870793-B2 · Jan 16, 2018 · US
Integrated circuits having copper bonding structures with silicon carbon nitride passivation layers thereon and methods for fabricating same
US-9859236-B2 · Jan 2, 2018 · US
Electric Guitar Strings of Magnetic Copper Alloys
US-2017365238-A1 · Dec 21, 2017 · US
Copper alloy sputtering target and method for manufacturing same
US-2017342546-A1 · Nov 30, 2017 · US
Leach-resistant leaded copper alloys
US-9829122-B2 · Nov 28, 2017 · US
Conductive material for connection parts which has excellent minute slide wear resistance
US-2017283910-A1 · Oct 5, 2017 · US
Copper-titanium Alloy Foil Having Plated Layer
US-2017285295-A1 · Oct 5, 2017 · US
White antimicrobial copper alloy
US-2017268081-A1 · Sep 21, 2017 · US
Cylindrical sputtering target material
US-9748079-B2 · Aug 29, 2017 · US
Sputtering target and manufacturing method therefor
US-9704695-B2 · Jul 11, 2017 · US
White antimicrobial copper alloy
US-9670566-B2 · Jun 6, 2017 · US
Copper alloy and method of manufacturing copper alloy
US-9666325-B2 · May 30, 2017 · US
Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and part for electronic equipment
US-2017130309-A1 · May 11, 2017 · US
Copper-based alloys, processes for producing the same, and products formed therefrom
US-2017120323-A1 · May 4, 2017 · US
Joining method, joint structure, electronic device, method for manufacturing electronic device and electronic part
US-9614295-B2 · Apr 4, 2017 · US
Materials for near field transducers, near field tranducers containing same, and methods of forming
US-2017069342-A1 · Mar 9, 2017 · US
Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and part for electronic equipment
US-9587299-B2 · Mar 7, 2017 · US
Copper alloy sheet strip with surface coating layer excellent in heat resistance
US-2017058382-A1 · Mar 2, 2017 · US
Integrated circuits having copper bonding structures with silicon carbon nitride passivation layers thereon and methods for fabricating same
US-2017040272-A1 · Feb 9, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C22C9/05?
- CPC C22C9/05 is the Cooperative Patent Classification code for “with manganese as the next major constituent.”
- How many patents are filed under CPC C22C9/05 (with manganese as the next major constituent)?
- Our database includes 159 publications tagged with this CPC code.
- Is patent activity under CPC C22C9/05 growing?
- Publication counts under this code: 5 in 2024 vs 6 in 2025 (latest complete years).