Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and part for electronic equipment

Patent metadata

Field	Value
Publication number	US-9587299-B2
Application number	US-201214349937-A
Country	US
Kind code	B2
Filing date	Oct 26, 2012
Priority date	Oct 28, 2011
Publication date	Mar 7, 2017
Grant date	Mar 7, 2017

Abstract

This copper alloy for electronic devices includes Mg at a content of 3.3 at % or more and 6.9 at % or less, with a remainder substantially being Cu and unavoidable impurities. When a concentration of Mg is given as X at %, an electrical conductivity σ (% IACS) is in a range of σ≦{1.7241/(−0.0347×X 2 +0.6569×X+1.7)}×100, and a stress relaxation rate at 150° C. after 1,000 hours is in a range of 50% or less.

First claim

The invention claimed is:

1. A rolled copper alloy material for electronic devices, consisting of:
a binary alloy of Cu and Mg, wherein
the binary alloy is a Cu—Mg solid solution alloy supersaturated with Mg,
the binary alloy consists of Mg at a content of 3.3 at % or more and 6.9 at % or less, and a remainder of Cu and unavoidable impurities,
an amount of Zn as an unavoidable impurity is less than 0.01 mass %,
a total amount of the unavoidable impurities is in a range of 0.3 mass % or less,
the rolled copper alloy material is a sheet or a strip,
the binary alloy has a measured value of electrical conductivity, σ, in a range of 31.2-44.1% IACS, wherein the measured value of electrical conductivity is less than or equal to an upper limit of electrical conductivity, in %, calculated by the formulaic expression, {1.7241/(−0.0347×X 2 +0.6569×X+1.7)}×100, wherein X is the content of the Mg in the binary alloy;
a stress relaxation rate is in a range of 50% or less after heating at 150° C. for 1,000 hours, and
a 0.2% proof stress σ 0.2 in a direction parallel to a rolling direction is in a range of 400 MPa or more.

2. The rolled copper alloy material for electronic devices according to claim 1 , wherein
an average number of intermetallic compounds mainly containing Cu and Mg and having grain sizes of 0.1 μm or greater is in a range of 1 piece/μm 2 or less during observation by a scanning electron microscope.

3. The rolled copper alloy material for electronic devices according to claim 1 ,
wherein a Young's modulus E in a direction parallel to a rolling direction is in a range of 125 GPa or less.

4. The rolled copper alloy material for electronic devices according to claim 1 ,
wherein the rolled copper alloy material is used as a copper material included in a part for a terminal, a connector, a relay, or a lead frame.

5. A part for electronic devices, comprising the rolled copper alloy material according to claim 1 .

6. The rolled copper alloy material for electronic devices according to claim 2 ,
wherein a Young's modulus E in a direction parallel to a rolling direction is in a range of 125 GPa or less.

7. The rolled copper alloy material for electronic devices according to claim 2 ,
wherein the rolled copper alloy material is used as a copper material included in a part for a terminal, a connector, a relay, or a lead frame.

8. A part for electronic devices, comprising the rolled copper alloy material according to claim 2 .

9. A method for producing a rolled copper alloy material for electronic devices, the method comprising:
a heating process of heating an ingot consisting of a binary alloy of Cu and Mg at a temperature of 400 to 900° C. to obtain a copper material;
a first rapid cooling process of cooling the copper material;
an intermediate heat treatment process of heating the copper material;
a second rapid cooling process of cooling the copper material;
a finishing working process of subjecting the copper material to rolling into a predetermined shape;
a finishing heat treatment process of subjecting the copper material to a heat treatment after the finishing working process; and
a third rapid cooling process of cooling the copper material, wherein
in the first, second and third rapid cooling processes, the copper material is cooled to a temperature of 200° C. or lower at a cooling rate of 200° C./min or higher,
wherein the produced rolled copper alloy material consists of the binary alloy of Cu and Mg,
the rolled alloy material is a solution alloy supersaturated with Mg,
the binary alloy consists of Mg at a content of 3.3 at % or more and 6.9 at % or less, and a remainder of Cu and unavoidable impurities,
an amount of Zn as an unavoidable impurity is less than 0.01 mass %,
a total amount of the unavoidable impurities is in a range of 0.3 mass % or less,
the rolled copper alloy material is a sheet or a strip,
the binary alloy has a measured value of electrical conductivity, σ, in a range of 31.2-44.1% IACS, wherein the measured value of electrical conductivity is less than or equal to an upper limit of electrical conductivity, in %, calculated by the formulaic expression, {1.7241/(−0.0347×X 2 +0.6569×X+1.7)}×100, wherein X is the content of the Mg in the binary alloy;
a stress relaxation rate of the rolled copper alloy material is in a range of 50% or less after heating at 150° C. for 1,000 hours, and
a 0.2% proof stress σ 0.2 of the rolled copper alloy material in a direction parallel to a rolling direction is in a range of 400 MPa or more.

10. The method for producing a rolled copper alloy material for electronic devices according to claim 9 , wherein,
in the intermediate heat treatment process, the heat treatment is performed at a temperature of 400° C. or higher and 900° C. or lower, and
in the finishing heat treatment process, the heat treatment is performed at a temperature of higher than 200° C. and 800° C. or lower.

11. A method for producing a rolled copper alloy material for electronic devices, the method comprising:
a heating process of heating an ingot consisting of a binary alloy of Cu and Mg at a temperature of 400 to 900° C. to obtain a copper material;
a first rapid cooling process of cooling the copper material;
an intermediate heat treatment process of heating the copper material;
a second rapid cooling process of cooling the copper material;
a finishing working process of subjecting the copper material to rolling into a predetermined shape;
a finishing heat treatment process of subjecting the copper material to a heat treatment after the finishing working process; and
a third rapid cooling process of the cooling copper material, wherein
in the first, second and third rapid cooling processes, the copper material is cooled to a temperature of 200° C. or lower at a cooling rate of 200° C./min or higher,
wherein the produced rolled copper alloy material consists of the binary alloy of Cu and Mg,
the rolled copper alloy material is a Cu—Mg solid solution alloy supersaturated with Mg,
the binary alloy consists of Mg at a content of 3.3 at % or more and 6.9 at % or less, and a remainder of Cu and unavoidable impurities,
an amount of Zn as an unavoidable impurity is less than 0.01 mass %,
a total amount of the unavoidable impurities is in a range of 0.3 mass % or less,
the rolled copper alloy material is a sheet or a strip,
the binary alloy has a measured value of electrical conductivity, σ, in a range of 31.2-44.1% IACS, wherein the measured value of electrical conductivity is less than or equal to an upper limit of electrical conductivity, in %, calculated by the formulaic expression, {1.7241/(−0.0347×X 2 +0.6569×X+1.7)}×100, wherein X is the content of the Mg in the binary alloy;
a stress relaxation rate of the rolled copper alloy material is in a range of 50% or less after heating at 150° C. for 1,000 hours,
a 0.2% proof stress σ 0.2 of the rolled copper alloy material in a direction parallel to a rolling direction is in a range of 400 MPa or more, and
an average number of intermetallic compounds mainly containing Cu and Mg and having grain sizes of 0.1 μm or greater in the rolled copper alloy material is in a range of 1 piece/μm 2 or less during observation by a scanning electron microscope.

12. The method for producing a rolled copper alloy material for electronic devices according to claim 11 , wherein
in the intermediate heat treatment process, the heat treatment is performed at a temperature of 400° C. or higher and 900° C. or lower, and
in the finishing heat treatment process, the heat treatment is performed at a temperature of higher than 200° C. and 800° C. or lower.

Assignees

• Mitsubishi Materials Corp

Inventors

• Maki Kazunari
• Ito Yuki

Classifications

• H01B13/0016

  for heat treatment · CPC title

• H01B1/026

  Alloys based on copper · CPC title

• C22F1/08 Primary

  of copper or alloys based thereon · CPC title

• C22C9/02

  with tin as the next major constituent · CPC title

• C22C9/05

  with manganese as the next major constituent · CPC title