Copper-coated titanium diboride articles
US-12522935-B2 · Jan 13, 2026 · US
Cu, e.g. Cu-CuO eutectic
Cu, e.g. Cu-CuO eutectic · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C04B41/5127 |
| Official title | {Cu, e.g. Cu-CuO eutectic} |
| Display label | Cu, e.g. Cu-CuO eutectic |
| Total patents | 49 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2016 | 4 |
| 2017 | 2 |
| 2018 | 3 |
| 2019 | 11 |
| 2020 | 6 |
| 2021 | 3 |
| 2022 | 6 |
| 2023 | 5 |
| 2024 | 4 |
| 2025 | 1 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Colored watch glass
US-2026008718-A1 · Jan 8, 2026 · US
Colored watch glass
US-12428335-B2 · Sep 30, 2025 · US
Method of Forming a Contact Piece for a Circuit Breaker
US-2024399619-A1 · Dec 5, 2024 · US
Method of manufacturing electronic component and electronic component
US-12014861-B2 · Jun 18, 2024 · US
Method for depositing a decorative and/or functional metal layer on a surface of an article made of an electrically non-conductive ceramic material
US-11952667-B2 · Apr 9, 2024 · US
Ceramic composition and wire-wound coil component
US-2024038426-A1 · Feb 1, 2024 · US
Method for producing a metal-ceramic substrate with electrically conductive vias
US-11804383-B2 · Oct 31, 2023 · US
Method for Producing a Metal-Ceramic Substrate with Electrically Conductive Vias
US-2023095753-A1 · Mar 30, 2023 · US
Method of manufacturing electronic component and electronic component
US-11605493-B2 · Mar 14, 2023 · US
Copper-ceramic composite
US-11584696-B2 · Feb 21, 2023 · US
Method for producing a metal-ceramic substrate with at least one via
US-11557490-B2 · Jan 17, 2023 · US
Ceramic and ceramic composite components
US-11384025-B2 · Jul 12, 2022 · US
Method for selectively metallizing surface of ceramic substrate, ceramic product and use of ceramic product
US-11382216-B2 · Jul 5, 2022 · US
Methods of manufacturing oxide/metal composite components and the components produced therefrom
US-11352681-B2 · Jun 7, 2022 · US
Method for depositing a decorative and/or functional metal layer on a surface of an article made of an electrically non-conductive ceramic material
US-2022155729-A1 · May 19, 2022 · US
Fluid heating component, and fluid heating component complex
US-11310873-B2 · Apr 19, 2022 · US
Method of metallizing ferrite ceramics and component comprising a metallized ferrite ceramic
US-11236024-B2 · Feb 1, 2022 · US
Multilayer type electronic component
US-11201015-B2 · Dec 14, 2021 · US
Copper-coated titanium diboride articles
US-2021355592-A1 · Nov 18, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C04B41/5127?
- CPC C04B41/5127 is the Cooperative Patent Classification code for “Cu, e.g. Cu-CuO eutectic.”
- How many patents are filed under CPC C04B41/5127 (Cu, e.g. Cu-CuO eutectic)?
- Our database includes 49 publications tagged with this CPC code.
- Is patent activity under CPC C04B41/5127 growing?
- Publication counts under this code: 4 in 2024 vs 1 in 2025 (latest complete years).