Method of manufacturing electronic component and electronic component

Patent metadata

Field	Value
Publication number	US-11605493-B2
Application number	US-201916374649-A
Country	US
Kind code	B2
Filing date	Apr 3, 2019
Priority date	Dec 13, 2016
Publication date	Mar 14, 2023
Grant date	Mar 14, 2023

Abstract

A method of manufacturing an electronic component capable of preventing entrance of a plating solution and a flux component at an interface to which an inner electrode of a ceramic element body is extended, and capable of forming an outer electrode of an arbitrary shape. A ceramic element body is made of a ceramic material containing a metal oxide, and part of an inner electrode is extended to extended surfaces of the ceramic element body. A base electrode is formed on each of the extended surfaces using a conductive paste to be connected to the inner electrode. Part of another surface of the ceramic element body adjacent to the extended surfaces is locally heated, and part of the metal oxide is reduced to form a reformed portion. A plating electrode is continuously formed over the base electrode and the reformed portion through a plating method to form outer electrodes.

First claim

What is claimed is:

1. A method of manufacturing an electronic component with an outer electrode formed on a ceramic element body, the method comprising:
providing the ceramic element body made of a sintered ceramic material containing a metal oxide, the ceramic element body having an inner electrode, part of the inner electrode being extended to an extended surface;
forming a base electrode on the extended surface of the ceramic element body so as to be connected to the inner electrode through electrode forming using a conductive paste or through dry plating;
forming a reformed portion by locally heating part of another surface of the ceramic element body adjacent to the extended surface and by a reduction reaction which reduces part of the metal oxide; and
forming a plating electrode on the base electrode and the reformed portion through wet plating.

2. The method of manufacturing the electronic component according to claim 1 , wherein
in the forming a plating electrode, the plating electrode is continuously formed over the base electrode and the reformed portion.

3. The method of manufacturing the electronic component according to claim 1 , wherein the ceramic material is ferrite.

4. The method of manufacturing the electronic component according to claim 1 , wherein
the electrode forming using the conductive paste is a method in which a conductive paste containing metal powder and glass is applied to the extended surface of the ceramic element body, and the metal powder and the glass are sintered by heat treatment to form the base electrode.

5. The method of manufacturing the electronic component according to claim 1 , wherein
the electrode forming using the conductive paste is a method in which a conductive paste containing a thermosetting resin and metal powder is applied to the extended surface of the ceramic element body, and the thermosetting resin are cured by heat treatment to form the base electrode.

6. The method of manufacturing the electronic component according to claim 1 , wherein
the reformed portion is formed at a position not in contact with the extended surface on the another surface of the ceramic element body adjacent to the extended surface.

7. The method of manufacturing the electronic component according to claim 1 , wherein
after the forming the base electrode, the forming the reformed portion is executed.

8. The method of manufacturing the electronic component according to claim 1 , wherein
the locally heating is performed by any one of laser irradiation, electron beam irradiation, or local heating by an image furnace.

9. The method of manufacturing the electronic component according to claim 1 , wherein the wet plating is electrolytic plating.

10. The method of manufacturing the electronic component according to claim 1 , wherein the wet plating is electroless plating.

11. The method of manufacturing the electronic component according to claim 2 , wherein the ceramic material is ferrite.

12. The method of manufacturing the electronic component according to claim 2 , wherein
the electrode forming using the conductive paste is a method in which a conductive paste containing metal powder and glass is applied to the extended surface of the ceramic element body, and the metal powder and the glass are sintered by heat treatment to form the base electrode.

13. The method of manufacturing the electronic component according to claim 2 , wherein
the electrode forming using the conductive paste is a method in which a conductive paste containing a thermosetting resin and metal powder is applied to the extended surface of the ceramic element body, and the thermosetting resin are cured by heat treatment to form the base electrode.

14. The method of manufacturing the electronic component according to claim 2 , wherein
the reformed portion is formed at a position not in contact with the extended surface on the another surface of the ceramic element body adjacent to the extended surface.

15. The method of manufacturing the electronic component according to claim 2 , wherein
after the forming the base electrode, the forming the reformed portion is executed.

16. The method of manufacturing the electronic component according to claim 2 , wherein
the locally heating is performed by any one of laser irradiation, electron beam irradiation, or local heating by an image furnace.

17. The method of manufacturing the electronic component according to claim 2 , wherein the wet plating is electrolytic plating.

18. The method of manufacturing the electronic component according to claim 2 , wherein the wet plating is electroless plating.

Assignees

• Murata Manufacturing Co

Inventors

• Maki Yoshifumi
• Ishida Takuya
• Hirai Shinya

Classifications

• C04B35/26

  based on ferrites · CPC title

• H01F27/2804 Primary

  Printed windings · CPC title

• H01F41/10

  Connecting leads to windings (making electric connections in general H01R43/00) · CPC title

• H01F17/0013

  with stacked layers · CPC title

• H01F41/041

  Printed circuit coils (apparatus or processes for manufacturing printed circuits in general H05K3/00) · CPC title