Method for selectively metallizing surface of ceramic substrate, ceramic product and use of ceramic product

Patent metadata

Field	Value
Publication number	US-11382216-B2
Application number	US-201916274103-A
Country	US
Kind code	B2
Filing date	Feb 12, 2019
Priority date	May 13, 2011
Publication date	Jul 5, 2022
Grant date	Jul 5, 2022

Abstract

A method for selectively metallizing a surface of a ceramic substrate, a ceramic product and use of the ceramic product are provided. The method comprises steps of: A) molding and sintering a ceramic composition to obtain the ceramic substrate, in which the ceramic composition comprises a ceramic powder and a functional powder dispersed in the ceramic powder; the ceramic powder is at least one selected from a group consisting of an oxide of E, a nitride of E, a oxynitride of E, and a carbide of E; E at least one selected from a group consisting of Li, Na, K, Rb, Cs, Be, Mg, Ca, Sr, Ba, B, Al, Ga, Si, Ge, P, As, Sc, Y, Zr, Hf, is and lanthanide elements; the functional powder is at least one selected from a group consisting of an oxide of M, a nitride of M, a oxynitride of M, a carbide of M, and a simple substance of M; and M is at least one selected from a group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Ta, W, Re, Os, Ir, Pt, Au, In, Sn, Sb, Pb, Bi, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu; B) radiating a predetermined region of the surface of the ceramic substrate using an energy beam to form a chemical plating active center on the predetermined region of the surface of the ceramic substrate; and C) performing chemical plating on the ceramic substrate formed with the chemical plating active center to form a metal layer on the predetermined region of the surface of the ceramic substrate.

First claim

What is claimed is:

1. A method for selectively metallizing a surface of a ceramic substrate, comprising steps of:
A) selecting a ceramic powder having at least one from a group consisting of an oxide of E, a nitride of E, a oxynitride of E, and a carbide of E, wherein E is at least one selected from a group consisting of Al, Zr, Si, Mg, and B; matching a functional powder based on the selected ceramic powder to obtain a desired compatibility between the functional powder and the ceramic powder for forming a eutectic liquid phase during a sintering process, by selecting the functional powder at least one from a group consisting of a nitride of M, a oxynitride of M, and a carbide of M, wherein M is at least one selected from a group consisting of Mn, Fe, Co, Ni, and Cu; molding a ceramic composition, wherein the ceramic composition comprises the ceramic powder and the functional powder, wherein based on the total weight of the ceramic composition, an amount of the ceramic powder is 70 wt % to 99.998 wt %, and the functional powder is uniformly dispersed in the ceramic powder; configuring a weight ratio between the ceramic powder and the functional powder and contents of the ceramic powder and the functional powder so that the functional powder reacts with adjacent ceramic powder during the sintering process to form a composite structure dispersed in the ceramic substrate, wherein the composite structure is at least one selected from a group consisting of a composite oxide of M and E, a composite nitride of M and E, a composite oxynitride of M and E, and a composite carbide of M and E; and sintering the ceramic composition under a mechanical pressure of 20 MPa to 200 MPa to form the eutectic liquid phase and to obtain the ceramic substrate;
B) irradiating a predetermined region of the surface of the ceramic substrate to form a chemical plating active region on the predetermined region of the surface of the ceramic substrate; and exposing the composite structure in the chemical plating active region from the ceramic substrate, wherein an upper surface of the chemical plating active region is lower than an upper surface of non-irradiated portions of the ceramic substrate; and
C) performing chemical plating directly on the exposed composite structure formed in the chemical plating active region to form a metal layer on the predetermined region of the surface of the ceramic substrate.

2. The method according to claim 1 , wherein M is at least one selected from a group consisting of Fe, Ni, and Cu for the nitride, the oxynitride, and the carbide.

3. The method according to claim 1 , wherein E is at least one selected from a group consisting of Al, Si, and Mg.

4. The method according to claim 1 , or wherein the ceramic powder is at least one selected from a group consisting of Al 2 O 3 , MgO, SiO 2 , Si 3 N 4 , and SiC.

5. The method according to claim 1 , wherein based on the total weight of the ceramic composition, the amount of the ceramic powder is 90 wt % to 99.998 wt %, and an amount of the functional powder is 0.002 wt % to 10 wt %.

6. The method according to claim 5 , wherein based on the total weight of the ceramic composition, the amount of the ceramic powder is 98 wt % to 99.995 wt %, and the amount of the functional powder is 0.005 wt % to 2 wt %.

7. The method according to claim 1 , wherein the functional powder is a simple substance of M.

8. The method according to claim 1 , wherein the irradiating uses an energy beam, which is at least one selected from a group consisting of a laser beam, an electron beam, and an ion beam.

9. The method according to claim 8 , wherein the laser beam has a laser radiation having a wavelength of 200 nm to 3000 nm, a power of 5 W to 3000 W, a frequency of 0.1 KHz to 200 KHz, a linear velocity of 0.01 mm/s to 50000 mm/s, and a fill spacing of 0.01 mm to 5 mm.

10. The method according to claim 8 , wherein the energy of the ion beam is 10 1 eV to 10 6 eV.

11. The method according to claim 8 , wherein the power density of the electron beam is 10 1 W/cm 2 to 10 11 W/cm 2 .

12. The method according to claim 1 , wherein the ceramic composition is sintered under an atmosphere of air or oxygen.

13. The method according to claim 1 ,
wherein E is at least two selected from a group consisting of Al, Zr, Si, Mg, and B; and
wherein after irradiating the predetermined region of the surface of the ceramic substrate to form the chemical plating active region, the upper surface of the chemical plating active region is recessed by 0.01 to 500 microns with respect to the upper surface of non-irradiated portions of the ceramic substrate.

14. The method according to claim 1 , wherein the step of performing chemical plating directly on the exposed composite structure formed in the chemical plating active region further comprises:
directly contacting the exposed composite structure formed in the chemical plating active region with a chemical plating solution that includes metal ions, and reducing the metal ions by the exposed composite structure to form the metal layer.

15. A method for selectively metallizing a surface of a ceramic substrate, comprising steps of:
A) selecting a ceramic powder having at least one from a group consisting of an oxide of E, a nitride of E, a oxynitride of E, and a carbide of E, wherein E is at least one selected from a group consisting of Al, Zr, Si, Mg, and B; matching a functional powder based on the selected ceramic powder to obtain a desired compatibility between the functional powder and the ceramic powder for forming a eutectic liquid phase during a sintering process, by selecting the functional powder at least one from a group consisting of a nitride of M, a oxynitride of M, and a carbide of M, wherein M is at least one selected from a group consisting of Mn, Fe, Co, Ni, and Cu; molding a ceramic composition, wherein the ceramic composition comprises the ceramic powder and the functional powder, wherein based on the total weight of the ceramic composition, an amount of at least one of the oxide of E, the nitride of E, the oxynitride of E, and the carbide of E in the ceramic powder is 70 wt % to 99.998 wt %, and the functional powder is uniformly dispersed in the ceramic powder; configuring a weight ratio between the ceramic powder and the functional powder and contents of the ceramic powder and the functional powder so that the functional powder reacts with adjacent ceramic powder during the sintering process to form a composite structure dispersed in the ceramic substrate, wherein the composite structure is at least one selected from a group consisting of a composite oxide of M and E, a composite nitride of M and E, a composite oxynitride of M and E, and a composite carbide of M and E; and sintering the ceramic composition under a mechanical pressure of 20 MPa to 200 MPa to form the eutectic liquid phase and to obtain the ceramic substrate;
B) irradiating a predetermined region of the surface of the ceramic substrate to form a chemical plating active region on the predetermined region of the surface of the ceramic substrate, and exposing the composite structure in the chemical plating active region from the ceramic substrate, wherein an upper surface of the chemical plating active region is lower than an upper surface of non-irradiated portions of the ceramic substrate; and
C) performing chemical plating directly on the exposed ceramic substrate formed in the chemical plating active region to form a metal layer on the predetermined region of the surface of the ceramic substrate.

16. The method of claim 15 , wherein E is at least two selected from a

Assignees

• Byd Co Ltd

Inventors

• Gong Qing
• Lin Xinping
• Ren Yongpeng
• Zhang Baoxiang

Classifications

• C23C18/1608

  from pretreatment step, i.e. selective pre-treatment · CPC title

• Y10T428/24917

  including metal layer · CPC title

• C23C18/1612

  through irradiation means · CPC title

• C23C18/1245

  Inorganic substrates other than metallic · CPC title

• C23C18/1639

  Substrates other than metallic, e.g. inorganic or organic or non-conductive · CPC title