Method for producing a metal-ceramic substrate with electrically conductive vias

Patent metadata

Field	Value
Publication number	US-11804383-B2
Application number	US-202218075559-A
Country	US
Kind code	B2
Filing date	Dec 6, 2022
Priority date	Aug 29, 2016
Publication date	Oct 31, 2023
Grant date	Oct 31, 2023

Abstract

A method for producing a metal-ceramic substrate with a plurality of electrically conductive vias includes: attaching a first metal layer in a planar manner to a first surface side of a ceramic layer; after attaching the first metal layer, introducing a copper hydroxide or copper acetate brine into a plurality of holes in the ceramic layer delimiting a via, to form an assembly; converting the copper hydroxide or copper acetate brine into copper oxide; subjecting the assembly to a high-temperature step above 500° C. in which the copper oxide forms a copper body in the plurality of holes; and after converting the copper hydroxide or copper acetate brine into the copper oxide, attaching a second metal layer in a planar manner to a second surface side of the ceramic layer opposite the first surface side. The copper body produces an electrically conductive connection between the first and the second metal layers.

First claim

What is claimed is:

1. A method for producing a metal-ceramic substrate with a plurality of electrically conductive vias, the method comprising:
attaching a first metal layer in a planar manner to a first surface side of a ceramic layer;
after attaching the first metal layer, introducing a copper hydroxide or copper acetate brine into a plurality of holes in the ceramic layer, with each of the plurality of holes delimiting one of the plurality of electrically conductive vias, to form an assembly;
converting the copper hydroxide or copper acetate brine into copper oxide;
subjecting the assembly to a high-temperature step above 500° C. in which the copper oxide forms a copper body in the plurality of holes; and
after converting the copper hydroxide or copper acetate brine into the copper oxide, attaching a second metal layer in a planar manner to a second surface side of the ceramic layer opposite the first surface side,
wherein the copper body produces an electrically conductive connection between the first and the second metal layers.

2. The method of claim 1 , wherein introducing the copper hydroxide or copper acetate brine into the plurality of holes comprises:
spraying the ceramic layer with the copper hydroxide or copper acetate brine.

3. The method of claim 1 , wherein introducing the copper hydroxide or copper acetate brine into the plurality of holes comprises:
immersing the ceramic layer in the copper hydroxide or copper acetate brine.

4. The method of claim 1 , wherein converting the copper hydroxide or copper acetate brine into the copper oxide comprises:
before subjecting the assembly to the high-temperature step, converting the copper hydroxide or copper acetate brine into the copper oxide by thermal conversion in a temperature range between 100° C. and 200° C.

5. The method of claim 1 , wherein the ceramic layer comprises an Al 2 O 3 , AlN or Si 3 N 4 ceramic.

6. The method of claim 1 , wherein a semiconductor component is attached to the second metal layer.

7. The method of claim 6 , wherein each of the plurality of electrically conductive vias are disposed underneath the semiconductor component.

8. The method of claim 1 , wherein the first and the second metal layers are attached to the ceramic layer by a direct copper bonding (DCB) method.

9. The method of claim 1 , wherein the first and the second metal layers are attached to the ceramic layer by an active metal brazing (AMB) method.

Assignees

• Infineon Technologies Ag

Inventors

• Roth Alexander

Classifications

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W70/692

  Ceramics or glasses · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W70/66

  Conductive materials thereof · CPC title

• H10W40/255

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title