Polycrystalline cubic boron nitride (pcbn) comprising microcrystalline cubic boron nitride (cbn) and method of making
US-2017369314-A1 · Dec 28, 2017 · US
in a direct manner, e.g. direct copper bonding [DCB]
in a direct manner, e.g. direct copper bonding [DCB] · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C04B37/021 |
| Official title | {in a direct manner, e.g. direct copper bonding [DCB]} |
| Display label | in a direct manner, e.g. direct copper bonding [DCB] |
| Total patents | 312 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 23 |
| 2016 | 31 |
| 2017 | 30 |
| 2018 | 21 |
| 2019 | 20 |
| 2020 | 37 |
| 2021 | 34 |
| 2022 | 23 |
| 2023 | 26 |
| 2024 | 32 |
| 2025 | 31 |
| 2026 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Customized magnetic susceptibility materials
US-9810751-B2 · Nov 7, 2017 · US
Copper Heat Dissipation Material, Carrier-Attached Copper Foil, Connector, Terminal, Laminate, Shield Material, Printed-Wiring Board, Metal Processed Member, Electronic Device and Method for Manufacturing the Printed Wiring Board
US-2017291397-A1 · Oct 12, 2017 · US
Bonded body, power module substrate with heat sink, heat sink, method of manufacturing bonded body, method of manufacturing power module substrate with heat sink, and method of manufacturing heat sink
US-2017271238-A1 · Sep 21, 2017 · US
Target material for sputtering and method for manufacturing same
US-2017130328-A1 · May 11, 2017 · US
Assembly comprising two elements of different thermal expansion coefficients and a sintered joint of heterogeneous density and process for manufacturing the assembly
US-2017012017-A1 · Jan 12, 2017 · US
Method for sintering workpieces to be sintered, and system for this purpose
US-2016368828-A1 · Dec 22, 2016 · US
Pump housing of two different sinterable materials
US-2016369813-A1 · Dec 22, 2016 · US
Sic matrix fuel cladding tube with spark plasma sintered end plugs
US-2016358673-A1 · Dec 8, 2016 · US
Abrasion-resistant weld overlay
US-2016355922-A1 · Dec 8, 2016 · US
Methods of forming polycrystalline elements from brown polycrystalline tables
US-2016348447-A1 · Dec 1, 2016 · US
Substrate structures and methods of manufacture
US-2016323997-A1 · Nov 3, 2016 · US
Superhard constructions & methods of making same
US-2016318808-A1 · Nov 3, 2016 · US
Substrate structures and methods of manufacture
US-2016324008-A1 · Nov 3, 2016 · US
Power module substrate, power module substrate with heat sink, and power module
US-9480144-B2 · Oct 25, 2016 · US
Manufacturing method of radiator-integrated substrate and radiator-integrated substrate
US-9474146-B2 · Oct 18, 2016 · US
Semiconductor module
US-9460981-B2 · Oct 4, 2016 · US
Method for Producing a Circuit Carrier Arrangement Having a Carrier which has a Surface Formed by an Aluminum/Silicon Carbide Metal Matrix Composite Material
US-2016284664-A1 · Sep 29, 2016 · US
SiC matrix fuel cladding tube with spark plasma sintered end plugs
US-9455053-B2 · Sep 27, 2016 · US
Methods of forming polycrystalline elements from brown polycrystalline tables
US-9440333-B2 · Sep 13, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C04B37/021?
- CPC C04B37/021 is the Cooperative Patent Classification code for “in a direct manner, e.g. direct copper bonding [DCB].”
- How many patents are filed under CPC C04B37/021 (in a direct manner, e.g. direct copper bonding [DCB])?
- Our database includes 312 publications tagged with this CPC code.
- Is patent activity under CPC C04B37/021 growing?
- Publication counts under this code: 32 in 2024 vs 31 in 2025 (latest complete years).