Assembly comprising two elements of different thermal expansion coefficients and a sintered joint of heterogeneous density and process for manufacturing the assembly

Patent metadata

Field	Value
Publication number	US-2017012017-A1
Application number	US-201615205273-A
Country	US
Kind code	A1
Filing date	Jul 8, 2016
Priority date	Jul 10, 2015
Publication date	Jan 12, 2017
Grant date	—

Abstract

An assembly comprises a first element having a first thermal expansion coefficient, a second element having a second thermal expansion coefficient and at least one joint connecting the first element and second element, wherein the joint is heterogeneous and includes a stack of at least one first elementary joint of first density and of a second elementary joint of second density, the first and second densities being different. A process for manufacturing an assembly according to the invention is provided.

First claim

1 . An assembly comprising a first element having a first thermal expansion coefficient, a second element having a second thermal expansion coefficient and at least one joint connecting said first element and said second element, wherein said joint is heterogeneous and includes a stack of at least one first elementary joint of first density and of a second elementary joint of second density, said first and second densities being different.

2 . The assembly according to claim 1 , wherein one of the elements comprises a semiconductor component, possibly a silicon diode.

3 . The assembly according to claim 1 , wherein said heterogeneous joint is metallic.

4 . The assembly according to claim 1 , wherein the first element and/or the second element have/has a metallic surface to be joined and attached to said joint.

5 . The assembly according to claim 1 , wherein at least one of the two elements is a ceramic substrate possibly made of Al 2 O 3 or of Si 3 N 4 or of AlN and possibly including at least one metallic layer on one of its faces.

6 . The assembly according to claim 1 , wherein the first element and the second element comprise a finishing layer intended to make contact with one of the elementary joints.

7 . The assembly according to claim 6 , wherein the thickness of the finishing layer is of the order of one nanometer or one micron.

8 . The assembly according to claim 1 , wherein at least one of the first and/or second elements have/has a surface made of copper, possibly a finishing layer.

9 . The assembly according to claim 1 , wherein the first elementary joint and/or the second elementary joint include/includes nanoparticles.

10 . The assembly according to claim 1 , wherein the first elementary joint includes microparticles, the second elementary joint including nanoparticles.

11 . The assembly according to claim 1 , wherein the first elementary joint and/or the second elementary joint are/is based on silver or copper or gold or silver and copper.

12 . The assembly according to claim 1 , wherein the first density is about 90% with respect to the bulk metal, which is possibly silver, the second density being about 60% relative to the bulk metal, which is possibly silver.

13 . A process for manufacturing an assembly comprising a joint of heterogeneous density and two elements of different thermal expansion coefficients, comprising the following steps:
depositing a first paste or a first film on the surface of the first element; a first sintering operation under first temperature and pressure conditions so as to produce a first elementary joint of first density; depositing a second paste or a second film on the surface of said first elementary joint; a second sintering operation under second temperature and pressure conditions so as to define a second elementary joint of second density different from said first density on the surface of the first elementary joint in order to form said heterogeneous joint; applying the second element.

14 . The process for manufacturing an assembly according to claim 13 , wherein the first and/or second paste are/is metallic or the first film and/or the second film are/is metallic.

15 . The process for manufacturing an assembly comprising a heterogeneous joint as claimed in claim 13 , wherein the second sintering operation is carried out under lower temperature and/or lower pressure conditions than those of the first sintering operation.

16 . The process for manufacturing an assembly comprising a heterogeneous joint according to claim 13 , wherein the first sintering operation is carried out while applying an intermediate part to said deposited first paste or to said first film, said part possibly being a glass plate or an element made of Teflon®, or an element made of ceramic, or an element made of aluminum, or an element made of diamond, or an element made of sapphire, or an element made of silicon, or an element made of silicon carbide.

17 . The process for manufacturing an assembly comprising a heterogeneous joint according to claim 13 , wherein the second sintering operation is carried out while applying the second element to the second paste or to the second film.

18 . The process for manufacturing an assembly comprising a heterogeneous joint according to claim 13 , comprising a step of drying said first paste and/or a step of drying said second paste.

19 . The process for manufacturing an assembly comprising a heterogeneous joint according to claim 13 , wherein the first paste and/or the second paste are/is deposited by screen printing.

20 . The process for manufacturing an assembly comprising a heterogeneous joint according to claim 13 , wherein, the first element having a copper surface, the first paste is silver-based and the second paste is also silver-based.

21 . The process for manufacturing an assembly comprising a heterogeneous joint according to claim 13 , wherein the first and/or second paste comprise/comprises metal nanoparticles.

22 . The process for manufacturing an assembly comprising a heterogeneous joint according to claim 13 , wherein the first element is a substrate and the second element is a semiconductor chip.

23 . The process for manufacturing an assembly comprising a heterogeneous joint according to claim 19 , wherein the first and second pastes are deposited by screen printing with the same type of sintering paste, the thickness of the deposited first paste possibly being larger than the thickness of the deposited second paste.

Assignees

• Commissariat Energie Atomique

Inventors

• Khazaka Rabih
• Thollin Benoît

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07331

  Connecting techniques · CPC title

• H10W72/01323

  in liquid form, e.g. by dispensing droplets or by screen printing · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title

• H10W72/351

  Materials of die-attach connectors · CPC title