Method for Producing a Circuit Carrier Arrangement Having a Carrier which has a Surface Formed by an Aluminum/Silicon Carbide Metal Matrix Composite Material

Patent metadata

Field	Value
Publication number	US-2016284664-A1
Application number	US-201615070089-A
Country	US
Kind code	A1
Filing date	Mar 15, 2016
Priority date	Mar 25, 2015
Publication date	Sep 29, 2016
Grant date	—

Abstract

According to a method for producing a circuit carrier arrangement, a carrier which has a surface section formed by an aluminum/silicon carbide metal matrix composite material is provided. A circuit carrier, which has an insulation carrier with a lower side onto which a lower metallization layer is applied, is also provided. A bonding layer, which contains a glass, is generated on the surface section. A material-fit connection between the bonding layer and the circuit carrier is produced by means of a connecting layer.

First claim

What is claimed is:

1 . A method for producing a circuit carrier arrangement, which comprises:
provision of a carrier which has a surface section formed by an aluminum/silicon carbide metal matrix composite material; provision of a circuit carrier which has an insulation carrier with a lower side onto which a lower metallization layer is applied; generation of a bonding layer, which contains a glass, on the surface section; production of a material-fit connection between the bonding layer and the circuit carrier by means of a connecting layer.

2 . The method as claimed in claim 1 , wherein the generation of the bonding layer containing a glass is carried out by:
applying a paste containing a glass onto the surface section; drying the applied paste; subjecting the carrier and the dried paste lying on its surface section to a heat treatment during which the glass contained in the dried paste is melted; and cooling the carrier and the dried paste, containing the molten glass, lying on its surface section after the heat treatment to below the glass transition temperature of the glass.

3 . The method as claimed in claim 2 , wherein the carrier and the dried paste lying on its surface section are not heated to more than 600° C.

4 . The method as claimed in claim 2 , wherein the paste contains a metal powder.

5 . The method as claimed in claim 4 , wherein the metal powder contains precisely one or any combination of two or more of the following materials: Cu, Ag, Pd, Au.

6 . The method as claimed in claim 1 , wherein the bonding layer has a thickness of more than 5 μm.

7 . The method as claimed in claim 1 , wherein the bonding layer ( 3 ) has a thickness (d 3 ) of less than 100 μm or less than 50 μm or less than 15 μm.

8 . The method as claimed in claim 7 , wherein the application of the paste containing the glass is carried out by screen or stencil printing.

9 . The method as claimed in claim 1 , wherein the glass ( 30 ) has a glass transition temperature below 600° C.

10 . The method as claimed in claim 1 , wherein the connecting layer is configured as a solder layer, or as a layer which contains a sintered metal powder.

11 . The method as claimed in claim 1 , wherein the connecting layer
is directly adjacent to the bonding layer; and/or is directly adjacent to the lower metallization layer.

12 . The method as claimed in claim 1 , wherein the insulation carrier of the circuit carrier provided has an upper side, opposite the lower side onto which an upper metallization layer is applied.

13 . The method as claimed in claim 1 , wherein the circuit carrier provided is equipped with a semiconductor chip.

14 . The method as claimed in claim 1 , wherein, after the production of the material-fit connection,
no nickel layer is arranged between the surface section and the connecting layer; and/or no nickel layer is arranged between the surface section and the bonding layer ( 3 ).

Assignees

• Infineon Technologies Ag

Inventors

• Hohlfeld Olaf

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07337

  using a polymer adhesive, e.g. an adhesive based on silicone or epoxy · CPC title

• H10W72/07336

  Soldering or alloying · CPC title

• H10W72/07335

  Applying EM radiation, e.g. induction heating or using a laser · CPC title

• H10W72/07331

  Connecting techniques · CPC title