Epitaxy substrate and method of manufacturing the same
US-11201080-B2 · Dec 14, 2021 · US
Joining the largest surface of one substrate with a smaller surface of the other substrate, e.g. butt joining or forming a T-joint
Joining the largest surface of one substrate with a smaller surface of the other substrate, e.g. butt joining or forming a T-joint · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C04B2237/80 |
| Official title | Joining the largest surface of one substrate with a smaller surface of the other substrate, e.g. butt joining or forming a T-joint |
| Display label | Joining the largest surface of one substrate with a smaller surface of the other substrate, e.g. butt joining or forming a T-joint |
| Total patents | 110 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 9 |
| 2016 | 11 |
| 2017 | 10 |
| 2018 | 4 |
| 2019 | 9 |
| 2020 | 11 |
| 2021 | 10 |
| 2022 | 13 |
| 2023 | 13 |
| 2024 | 11 |
| 2025 | 4 |
| 2026 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devices
US-11091397-B2 · Aug 17, 2021 · US
Method of producing a multi-layer ceramic electronic component and multi-layer ceramic electronic component
US-2021233714-A1 · Jul 29, 2021 · US
Ceramic matrix composite component including counterflow channels and method of producing
US-2021189901-A1 · Jun 24, 2021 · US
Multilayer electronic component
US-2021090806-A1 · Mar 25, 2021 · US
Repair and/or reinforcement of oxide-oxide cmc
US-2021061720-A1 · Mar 4, 2021 · US
Multilayer ceramic electronic device and method for making same
US-2020357574-A1 · Nov 12, 2020 · US
Semiconductor manufacturing device member, method for manufacturing the same, and forming die
US-2020258769-A1 · Aug 13, 2020 · US
Multi-layer ceramic capacitor and method of producing the same
US-2020258689-A1 · Aug 13, 2020 · US
Method for producing a ceramic component composed of a plurality of joined preforms and component obtained by the method
US-10696600-B2 · Jun 30, 2020 · US
Wafer support
US-2020161106-A1 · May 21, 2020 · US
Integral ceramic matrix composite fastener with non-polymer rigidization
US-2020147835-A1 · May 14, 2020 · US
Ceramic-metal structure
US-10639736-B2 · May 5, 2020 · US
Bonded body, power module substrate with heat sink, heat sink, method of manufacturing bonded body, method of manufacturing power module substrate with heat sink, and method of manufacturing heat sink
US-10600719-B2 · Mar 24, 2020 · US
Multilayer ceramic capacitor including adhesive layer between side margin portion and body and method of manufacturing the same
US-2020043667-A1 · Feb 6, 2020 · US
Multilayer ceramic capacitor including adhesive layer between side margin portion and body and method of manufacturing the same
US-2020043668-A1 · Feb 6, 2020 · US
Integral ceramic matrix composite fastener with non-polymer rigidization
US-10538013-B2 · Jan 21, 2020 · US
Joining method for optical part
US-2019315646-A1 · Oct 17, 2019 · US
Epitaxy substrate and method of manufacturing the same
US-2019304831-A1 · Oct 3, 2019 · US
Bonded ceramic assembly
US-2019263725-A1 · Aug 29, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C04B2237/80?
- CPC C04B2237/80 is the Cooperative Patent Classification code for “Joining the largest surface of one substrate with a smaller surface of the other substrate, e.g. butt joining or forming a T-joint.”
- How many patents are filed under CPC C04B2237/80 (Joining the largest surface of one substrate with a smaller surface of the other substrate, e.g. butt joining or forming a T-joint)?
- Our database includes 110 publications tagged with this CPC code.
- Is patent activity under CPC C04B2237/80 growing?
- Publication counts under this code: 11 in 2024 vs 4 in 2025 (latest complete years).