Wafer support

Patent metadata

Field	Value
Publication number	US-2020161106-A1
Application number	US-202016751742-A
Country	US
Kind code	A1
Filing date	Jan 24, 2020
Priority date	Jul 4, 2018
Publication date	May 21, 2020
Grant date	—

Abstract

A wafer support includes an RF electrode and a heater electrode that are embedded inside a disk-shaped ceramic base having a wafer placement surface. The RF electrode is constituted by a plurality of RF zone electrodes that are individually disposed for each of a plurality of divided zones of the wafer placement surface. The plurality of RF zone electrodes are separately disposed in at least two stages that are positioned at different distances from the wafer placement surface. The heater electrode is constituted by a plurality of heater zone electrodes that are individually disposed for each of a plurality of divided zones of the wafer placement surface, the zones being divided in a similar or different way to or from the RF zone electrodes.

First claim

What is claimed is:

1 . A wafer support including an RF electrode and a heater electrode that are embedded inside a disk-shaped ceramic base having a wafer placement surface,
wherein the RF electrode is constituted by a plurality of RF zone electrodes that are individually disposed for each of a plurality of divided zones of the wafer placement surface, the plurality of RF zone electrodes are separately disposed in at least two stages that are positioned at different distances from the wafer placement surface, the heater electrode is constituted by a plurality of heater zone electrodes that are individually disposed for each of a plurality of divided zones of the wafer placement surface, the zones being divided in a similar or different way to or from the RF zone electrodes, the plurality of RF zone electrodes are independently connected to a plurality of RF zone electrode conductors through electrode terminals disposed on a rear surface of the ceramic base, and the plurality of heater zone electrodes are independently connected to a plurality of heater zone electrode conductors through electrode terminals disposed on the rear surface of the ceramic base.

2 . The wafer support according to claim 1 , wherein the RF electrode includes, as the plurality of RF zone electrodes, a circular electrode concentric to the ceramic base or a plurality of divided electrodes of the circular electrode, and further includes, outside the circular electrode or the plurality of divided electrodes of the circular electrode, one or more annular electrodes concentric to the ceramic base or a plurality of divided electrodes of at least one of the annular electrodes.

3 . The wafer support according to claim 1 , wherein at least one of the heater zone electrodes is arranged in a gap between the RF zone electrodes when the ceramic base is viewed from the side facing the wafer placement surface.

4 . The wafer support according to claim 3 , wherein the heater zone electrode arranged in the gap is a gap heater zone electrode having a similar shape to a shape of the gap.

5 . The wafer support according to claim 1 , wherein shapes of the plurality of RF zone electrodes and shapes of the plurality of heater zone electrodes are in match with each other when the ceramic base is viewed from the side facing the wafer placement surface.

6 . The wafer support according to claim 1 , wherein the plurality of RF zone electrodes include a circular electrode concentric to the ceramic base and one or more annular electrodes concentric to the ceramic base, the annular electrodes being positioned outside the circular electrode,
the plurality of heater zone electrodes constituting the heater electrode are disposed on the same plane, and heights of the plurality of RF zone electrodes from the heater electrode are set such that the height of the RF zone electrode positioned closer to a center of the ceramic base is higher.

7 . The wafer support according to claim 1 , wherein the plurality of RF zone electrodes include a circular electrode concentric to the ceramic base and one or more annular electrodes concentric to the ceramic base, the annular electrodes being positioned outside the circular electrode,
the plurality of heater zone electrodes constituting the heater electrode are disposed on the same plane, and heights of the plurality of RF zone electrodes from the heater electrode are set such that the height of the RF zone electrode positioned closer to a center of the ceramic base is lower.

8 . The wafer support according to claim 6 , wherein thicknesses of the ceramic base in regions above the RF zone electrodes are equal to each other.

9 . The wafer support according to claim 7 , wherein thicknesses of the ceramic base in regions above the RF zone electrodes are equal to each other.

10 . The wafer support according to claim 1 , further including a hollow ceramic shaft bonded to a central region of a surface of the ceramic base on the side opposite to the wafer placement surface,
wherein the RF zone electrode conductors and the heater electrode conductors are disposed inside the ceramic shaft.

Assignees

• Ngk Insulators Ltd

Inventors

• Takahashi Tomohiro

Classifications

• H01J37/32577

  Electrical connecting means · CPC title

• H01J37/32724 Primary

  Temperature · CPC title

• B32B18/00

  Layered products essentially comprising ceramics, e.g. refractory products · CPC title

• H01J37/32568

  Relative arrangement or disposition of electrodes; moving means · CPC title

• H01J37/32541 Primary

  Shape · CPC title