Method for Joining Ceramic Bodies by means of an Active Hard Solder, or Braze, Assembly having at least two Ceramic Bodies joined with one another, especially a Pressure Measuring Cell
US-2015160086-A1 · Jun 11, 2015 · US
US10639736B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10639736-B2 |
| Application number | US-201716302758-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 14, 2017 |
| Priority date | Jul 19, 2016 |
| Publication date | May 5, 2020 |
| Grant date | May 5, 2020 |
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A ceramic-metal structure in which a metallic body ( 2 ) is inserted into or disposed above a through hole ( 4 h ) of a ceramic substrate ( 4 ) and which includes an annular pad layer ( 6 ) disposed around the through hole; an annular ring member ( 8 ) joined to the pad layer via a first brazing filler portion ( 10 ) and having a coefficient of thermal expansion smaller than that of the metallic body; a second brazing filler portion ( 12 ) intervening between the ring member and metallic body; and brazing filler flow prevention layers ( 7 a, 7 b ) covering an outer surface of the pad layer so as to expose a central region ( 6 c ) of the outer surface of the pad layer facing the first brazing filler portion. The first brazing filler portion joins the central region and the ring member without projecting to a radially inner or outer side of the flow prevention layers.
Opening claim text (preview).
The invention claimed is: 1. A ceramic-metal structure in which a pipe-shaped or rod-shaped metallic body is inserted into a through hole extending through a ceramic substrate from a surface of the ceramic substrate in a thickness direction thereof or is coaxially disposed just above the through hole, the ceramic-metal structure comprising: an annular pad layer made of a metal and disposed on the surface of the ceramic substrate to be located around the through hole; an annular ring member joined to the pad layer via a first brazing filler portion and having a coefficient of thermal expansion smaller than that of the metallic body; a second brazing filler portion intervening between the ring member and the metallic body and joining the ring member and the metallic body together; and a brazing filler flow prevention layer which covers an outer surface of the pad layer in such a manner as to expose a central region of an upper surface of the outer surface of the pad layer, the upper surface facing the first brazing filler portion, wherein the first brazing filler portion joins the central region and the ring member together without projecting to a radially inner side and a radially outer side of the brazing filler flow prevention layer. 2. A ceramic-metal structure according to claim 1 , wherein the ring member has an outer diameter smaller than that of the pad layer, and the first brazing filler portion has a portion which is in contact with a peripheral surface of the ring member and forms a fillet shape. 3. A ceramic-metal structure according to claim 1 , wherein the first brazing filler portion has a portion which extends toward a radially inner side of the ring member and forms a fillet shape. 4. A ceramic-metal structure according to claim 1 , wherein the ceramic substrate and the brazing filler flow prevention layer contain the same material as their main components. 5. A ceramic-metal structure according to claim 1 , wherein the ceramic substrate has a flow channel formed therein which is connected to the through hole and through which gas flows, the metallic body is pipe-shaped, and exchange of gas can be performed between the flow channel and the outside of the ceramic substrate through an internal space of the metallic body.
specially adapted for soldering seams · CPC title
at least one member being a tube · CPC title
based on copper · CPC title
Forming laminates or joining articles wherein at least one substrate contains at least two different parts of macro-size, e.g. one ceramic substrate layer containing an embedded conductor or electrode · CPC title
characterised by the interlayer used (C04B37/028 takes precedence) · CPC title
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