Ceramic-aluminum assembly with bonding trenches
US-2019314918-A1 · Oct 17, 2019 · US
whereby the interlayer is not continuous, e.g. not the whole surface of the smallest substrate is covered by the interlayer
whereby the interlayer is not continuous, e.g. not the whole surface of the smallest substrate is covered by the interlayer · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C04B2237/592 |
| Official title | whereby the interlayer is not continuous, e.g. not the whole surface of the smallest substrate is covered by the interlayer |
| Display label | whereby the interlayer is not continuous, e.g. not the whole surface of the smallest substrate is covered by the interlayer |
| Total patents | 126 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 14 |
| 2016 | 15 |
| 2017 | 12 |
| 2018 | 11 |
| 2019 | 14 |
| 2020 | 14 |
| 2021 | 9 |
| 2022 | 8 |
| 2023 | 14 |
| 2024 | 7 |
| 2025 | 6 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method for producing a connection between two ceramic parts—in particular, of parts of a pressure sensor
US-10435330-B2 · Oct 8, 2019 · US
Method for producing hermetic package, and hermetic package
US-2019296194-A1 · Sep 26, 2019 · US
Light converter assemblies with enhanced heat dissipation
US-10374137-B2 · Aug 6, 2019 · US
Polycrystalline ceramic substrate, bonding-layer-including polycrystalline ceramic substrate, and laminated substrate
US-2019131123-A1 · May 2, 2019 · US
Method for joining silicon carbide components to one another
US-10217534-B2 · Feb 26, 2019 · US
Thick-film paste mediated ceramics bonded with metal or metal hybrid foils
US-2019002359-A1 · Jan 3, 2019 · US
Apparatus including a ceramic component, a metal component, and a glass sealing material and a process of forming the apparatus
US-2019002337-A1 · Jan 3, 2019 · US
Gas sensor
US-10113988-B2 · Oct 30, 2018 · US
Method for joining silicon carbide components to one another
US-2018308589-A1 · Oct 25, 2018 · US
Ceramic matrix composite component and method of forming thereof
US-10071537-B2 · Sep 11, 2018 · US
Method for manufacturing an acoustic attenuation panel made of an oxide ceramic-matrix composite material
US-2018230063-A1 · Aug 16, 2018 · US
Refractory article and method of forming
US-2018216889-A1 · Aug 2, 2018 · US
Direct metal bonding on carbon-covered ceramic contact projections of a ceramic carrier
US-10000423-B1 · Jun 19, 2018 · US
Assembly having at least two ceramic bodies joined with one another, especially a pressure measuring cell, and method for joining ceramic bodies by means of an active hard solder, or braze
US-9931717-B2 · Apr 3, 2018 · US
Method of producing bonded body and method of producing power module substrate
US-9905437-B2 · Feb 27, 2018 · US
Dual-walled ceramic matrix composite (CMC) component with integral cooling and method of making a CMC component with integral cooling
US-9896954-B2 · Feb 20, 2018 · US
Method for producing hermetic package
US-2018033951-A1 · Feb 1, 2018 · US
Power-module substrate and manufacturing method thereof
US-9862045-B2 · Jan 9, 2018 · US
Ceramic pressure sensor and method for its production
US-9835510-B2 · Dec 5, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C04B2237/592?
- CPC C04B2237/592 is the Cooperative Patent Classification code for “whereby the interlayer is not continuous, e.g. not the whole surface of the smallest substrate is covered by the interlayer.”
- How many patents are filed under CPC C04B2237/592 (whereby the interlayer is not continuous, e.g. not the whole surface of the smallest substrate is covered by the interlayer)?
- Our database includes 126 publications tagged with this CPC code.
- Is patent activity under CPC C04B2237/592 growing?
- Publication counts under this code: 7 in 2024 vs 6 in 2025 (latest complete years).