Light converter assemblies with enhanced heat dissipation

Patent metadata

Field	Value
Publication number	US-10374137-B2
Application number	US-201515118075-A
Country	US
Kind code	B2
Filing date	Mar 10, 2015
Priority date	Mar 11, 2014
Publication date	Aug 6, 2019
Grant date	Aug 6, 2019

Abstract

The present disclosure is directed to light converter assemblies with enhanced heat dissipation. A light converter assembly may comprise a confinement material applied to at least a first substrate and a phosphor material also deposited on the first substrate so as to be surrounded by the confinement material. The first substrate may be hermetically sealed to a second substrate using the confinement material so that the phosphor material is confined between the substrates and protected from atmospheric contamination. The substrates may comprise, for example, sapphire to allow for light beam transmission and heat conductance. Confinement materials that may be employed to seal the first substrate to the second substrate may include, for example, silicon or a metal (e.g., silver, copper, aluminum, etc.) The phosphor material may comprise, for example, at least one quantum dot material.

First claim

What is claimed is:

1. A light converter assembly comprising:
a first substrate and a second substrate, the first and second substrates comprising a light transmissive, thermally conductive material;
a phosphor material disposed between the first and second substrates;
a confinement material disposed between the first and second substrates, the confinement material surrounding the phosphor material and bonding the first and second substrates together to hermetically seal the phosphor material between the first and second substrates,
wherein the confinement material has a thermal conductivity greater than 10 W/m*K,
wherein the confinement material comprises two layers, and
wherein a first layer of the confinement material is deposited on a surface of the first substrate and a second layer of the confinement material is deposited on a surface of the second substrate; and

a heat sink attached to the second substrate and the first layer of the confinement material on the first substrate, wherein the first substrate is larger than the second substrate such that an interfacial area of the first substrate and the heat sink is increased, and wherein the heat sink comprises an aperture positioned so that an excitation beam is able to impinge on the phosphor material.

2. The light converter assembly according to claim 1 , wherein the heat sink covers a side surface of the second layer of the confinement material.

3. The light converter assembly according to claim 1 , wherein the phosphor material is arranged within an opening in the second layer of the confinement material.

4. The light converter assembly according to claim 3 , wherein a further opening, aligned with the opening in the second layer of the confinement material, is formed in the first layer of the confinement material, wherein the phosphor material is further arranged within the further opening.

5. The light converter assembly according to claim 3 , wherein a recess, aligned with the opening in the second layer of the confinement material, is formed in the surface of the second substrate, wherein the phosphor material is further arranged within the recess.

6. The light converter assembly according to claim 3 , wherein the first layer of the confinement material covers a top surface of the phosphor material completely, and wherein the second layer of the confinement material covers a side surface of the phosphor material completely.

7. The light converter assembly according to claim 1 , wherein the first and second layers of the confinement material covers at least about 50% of the corresponding first and second substrate surface to which it is applied.

8. The light converter assembly according to claim 7 , wherein the first and second layers of the confinement material cover at least about 75% of the corresponding first and second substrate surface to which it is applied.

9. The light converter assembly according to claim 8 , wherein the first and second layers of the confinement material cover at least about 50% of the corresponding first and second substrate surface to which it is applied.

10. The light converter assembly according to claim 1 , wherein the first and second substrates comprise sapphire.

11. The light converter assembly according to claim 10 , wherein the confinement material has a thermal conductivity greater than a thermal conductivity of the first and second substrates.

12. The light converter assembly according to claim 10 , wherein the confinement material has a thermal conductivity of at least 100 W/m*K.

13. The light converter assembly according to claim 10 , wherein the confinement material comprises at least one of silicon, aluminum, silver or copper.

14. The light converter assembly according to claim 13 , wherein the first and second substrates are flat plates and the confinement material is silicon.

15. The light converter assembly according to claim 1 , wherein the first and second layers of the confinement material have a different composition.

16. The light converter assembly according to claim 1 , further comprising a bonding facilitator material, wherein the bonding facilitator material is disposed between the first and second layers of the confinement material.

17. The light converter assembly according to claim 1 , further comprising a reflective material located between the first and second substrates in an area corresponding to at least an area of the phosphor material.

18. The light converter assembly according to claim 17 , wherein the reflective material has a composition that is the same as the confinement material.

19. The light converter assembly according to claim 1 , wherein the phosphor material comprises a plurality of quantum dots deposited substantially in one or more monolayers.

20. The light converter assembly according to claim 19 , wherein the phosphor material further comprises at least one layer of a coating to prevent agglomeration of the plurality of quantum dots.

21. The light converter assembly according to claim 20 , wherein the coating comprises aluminum oxide.

22. A light converter assembly comprising:
a first substrate and a second substrate, the first and second substrates comprising a light transmissive thermally conductive material;
a phosphor material disposed between the first and second substrates; and
a confinement material disposed between the first and second substrates, the confinement material surrounding the phosphor material and bonding the first and second substrates together to hermetically seal the phosphor material between the first and second substrates,
wherein the confinement material has a thermal conductivity greater than 10 W/m*K,
wherein the confinement material comprises two layers,
wherein a first layer of the confinement material is deposited on a surface of the first substrate and a second layer of the confinement material is deposited on a surface of the second substrate,
wherein the phosphor material is located in an opening of the second layer of the confinement material,
wherein the first layer of the confinement material covers a top surface of the phosphor material completely, and
wherein the second layer of the confinement material covers a side surface of the phosphor material completely.

23. The light converter assembly according to claim 22 , further comprising a heat sink coupled to at least one of the first and second substrates.

Assignees

• Osram Gmbh
• Osram Opto Semiconductors Gmbh

Inventors

• Anc Maria
• Lenef Alan

Classifications

• H01L33/501

  Electricity · mapped topic

• H01L33/508

  Electricity · mapped topic

• B32B2307/302

  Conductive · CPC title

• B32B7/04

  Interconnection of layers · CPC title

• B32B2315/02

  Ceramics · CPC title