Power module substrate with heat sink, and method for producing power module substrate with heat sink
US-9237682-B2 · Jan 12, 2016 · US
Power-module substrate and manufacturing method thereof
US9862045B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9862045-B2 |
| Application number | US-201314388953-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 27, 2013 |
| Priority date | Mar 29, 2012 |
| Publication date | Jan 9, 2018 |
| Grant date | Jan 9, 2018 |
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- Title
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- Abstract
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Abstract
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To provide a power-module substrate and a manufacturing method thereof in which small voids are reduced at a bonded part and separation can be prevented. Bonding a metal plate of aluminum or aluminum alloy to at least one surface of a ceramic substrate by brazing, when a cross section of the metal plate is observed by a scanning electron microscope in a field of 3000 magnifications in a depth extent of 5 μm from a bonded interface between the metal plate and the ceramic substrate in a width area of 200 μm from a side edge of the metal plate, residual-continuous oxide existing continuously by 2 μm or more along the bonded interface has total length of 70% or less with respect to a length of the field.
First claim
Opening claim text (preview).
What is claimed is: 1. A power-module substrate made by bonding a metal plate made of aluminum or aluminum alloy to at least one surface of a ceramic substrate in a shape of a plate by brazing, wherein residual oxide existing continuously by 2 μm or more along a bonded interface between the metal plate and the ceramic substrate has total length of 70% or less and 20% or more with respect to a length of a field of 3000 magnifications by observing a cross section of the metal plate in a depth extent of 5 μm from the bonded interface in a width area of 200 μm from a side edge of the metal plate by a scanning electron microscope.
Assignees
Inventors
Classifications
Die-attach connectors and bond wires · CPC title
Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title
by flowing liquids, e.g. forced water cooling · CPC title
- H10W40/255Primary
having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title
Aluminium · CPC title
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Frequently asked questions
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- What does patent US9862045B2 cover?
- To provide a power-module substrate and a manufacturing method thereof in which small voids are reduced at a bonded part and separation can be prevented. Bonding a metal plate of aluminum or aluminum alloy to at least one surface of a ceramic substrate by brazing, when a cross section of the metal plate is observed by a scanning electron microscope in a field of 3000 magnifications in a depth e…
- Who is the assignee on this patent?
- Mitsubishi Materials Corp
- What technology area does this patent fall under?
- Primary CPC classification H10W40/255. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 09 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).