Thick-film paste mediated ceramics bonded with metal or metal hybrid foils

Patent metadata

Field	Value
Publication number	US-2019002359-A1
Application number	US-201616064564-A
Country	US
Kind code	A1
Filing date	Dec 21, 2016
Priority date	Dec 22, 2015
Publication date	Jan 3, 2019
Grant date	—

Abstract

Described is a process for preparing a ceramic substrate bonded with a metal foil. Moreover, described is a metal-ceramic-substrate provided with a thick-film layer and the use of a thick-film paste for bonding a metal foil onto a ceramic substrate.

First claim

1 .- 15 . (canceled)

16 . A process for preparing a structured metal-ceramic substrate, comprising:
applying a thick-film paste onto a ceramic substrate; applying a metal foil onto the thick-film layer of the ceramic substrate; and bonding the metal foil with the ceramic substrate via the thick-film layer.

17 . The process according to claim 16 , wherein one of the thick-film paste and the metal foil is applied either continuously or discontinuously.

18 . The process according to claim 16 , wherein the thick-film paste is coated onto the ceramic substrate by one of screen printing and multilayer printing.

19 . The process according to claim 16 , wherein the metal foil and/or the thick-film layer is oxidized before bonding to the ceramic substrate.

20 . The process according to claim 16 , wherein the thick-film paste is applied onto the substrate by multilayer coating and a first coating of this multilayer coating is provided with lines for contacts.

21 . The process according to claim 16 , wherein the thick-film paste comprises at least one of copper, Bi 2 O 3 , a glass material, and copper in an amount of one of from 40 to 92 wt.-%, 70 to 92 wt.-%, and 75 to 90 wt.-%, each based on the total weight of the thick-film paste.

22 . A process for preparing a structured metal-ceramic substrate, comprising:
applying a thick-film paste onto a metal foil; applying a ceramic substrate onto the thick-film layer of the metal foil; and bonding the metal foil with the ceramic substrate via the thick-film layer.

23 . The process according to claim 22 , wherein one of the thick-film paste and the metal foil is applied either continuously or discontinuously.

24 . The process according to claim 22 , wherein the thick-film paste is coated onto the metal foil by one of screen printing and multilayer printing.

25 . The process according to claim 22 , wherein the metal foil and/or the thick-film layer is oxidized before bonding to the ceramic substrate.

26 . The process according to claim 22 , wherein the thick-film paste comprises at least one of copper, Bi 2 O 3 , a glass material, and copper in an amount of one of from 40 to 92 wt.-%, 70 to 92 wt.-%, and 75 to 90 wt.-%, each based on the total weight of the thick-film paste.

27 . A metal-ceramic substrate, comprising
a ceramic substrate and, provided thereon, a metal-containing thick-film layer, and, provided thereon; a metal foil.

28 . The metal-ceramic substrate according to claim 27 , wherein the thick-film layer and/or the metal foil is structured.

29 . Use of a thick-film paste for preparing a metal-ceramic substrate as intermediate layer between a ceramic substrate and a metal foil.

30 . The use according to claim 29 , characterized in that the thick-film paste comprises copper as a metal and optionally Bi 2 O 3 .

Assignees

• Heraeus Deutschland Gmbh & Co Kg

Inventors

• Gundel Paul
• Miric Anton
• Bawohl Melanie
• Zier Gabriel
• Herbst Kai

Classifications

• H10W72/30

  Die-attach connectors · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H10W70/098

  Applying pastes or inks, e.g. screen printing (H10W70/095 takes precedence) · CPC title

• C04B2237/366

  Aluminium nitride · CPC title

• C04B2237/10

  Glass interlayers, e.g. frit or flux · CPC title