Mechanically compliant nanofibrous barrier
US-2024181401-A1 · Jun 6, 2024 · US
separating the processed structure from a mother substrate
separating the processed structure from a mother substrate · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B81C99/008 |
| Official title | {separating the processed structure from a mother substrate} |
| Display label | separating the processed structure from a mother substrate |
| Total patents | 56 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 6 |
| 2016 | 7 |
| 2017 | 5 |
| 2018 | 14 |
| 2019 | 11 |
| 2020 | 1 |
| 2021 | 6 |
| 2022 | 3 |
| 2023 | 1 |
| 2024 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Inattentive HF Concentration Vapors Phase Release of Micro-electro-mechanical Systems and Optical Systems
US-2024140786-A1 · May 2, 2024 · US
Three-dimensional features formed in molded panel
US-11807523-B2 · Nov 7, 2023 · US
Method for manufacturing a timepiece component
US-11385596-B2 · Jul 12, 2022 · US
Processing method for wafer
US-11315821-B2 · Apr 26, 2022 · US
Three-dimensional features formed in molded panel
US-2022002149-A1 · Jan 6, 2022 · US
Three-dimensional features formed in molded panel
US-11148942-B2 · Oct 19, 2021 · US
Glass piece and methods of manufacturing glass pieces and semiconductor devices with glass pieces
US-11148943-B2 · Oct 19, 2021 · US
Nanopatterned biosensor electrode for enhanced sensor signal and sensitivity
US-11022577-B2 · Jun 1, 2021 · US
Fabrication and self-aligned local functionalization of nanocups and various plasmonic nanostructures on flexible substrates for implantable and sensing applications
US-11002908-B2 · May 11, 2021 · US
Processing method for wafer
US-2021066111-A1 · Mar 4, 2021 · US
Device and methods for the transfer of chips from a source substrate onto a destination substrate
US-10923460-B2 · Feb 16, 2021 · US
Nanopatterned biosensor electrode for enhanced sensor signal and sensitivity
US-10775335-B2 · Sep 15, 2020 · US
Device and methods for the transfer of chips from a source substrate onto a destination substrate
US-2019393201-A1 · Dec 26, 2019 · US
Flexible disposable MEMS pressure sensor
US-10479677-B2 · Nov 19, 2019 · US
Systems and methods for controlling release of transferable semiconductor structures
US-10361124-B2 · Jul 23, 2019 · US
Systems and methods for controlling release of transferable semiconductor structures
US-10347535-B2 · Jul 9, 2019 · US
Method for fabrication of a timepiece provided with a multi-level exterior element
US-10301732-B2 · May 28, 2019 · US
Method for manufacturing a timepiece component
US-2019137934-A1 · May 9, 2019 · US
Manufacture of a multi-level timepiece component
US-10268115-B2 · Apr 23, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B81C99/008?
- CPC B81C99/008 is the Cooperative Patent Classification code for “separating the processed structure from a mother substrate.”
- How many patents are filed under CPC B81C99/008 (separating the processed structure from a mother substrate)?
- Our database includes 56 publications tagged with this CPC code.
- Is patent activity under CPC B81C99/008 growing?
- Publication counts under this code: 1 in 2023 vs 2 in 2024 (latest complete years).