Three-dimensional features formed in molded panel

Patent metadata

Field	Value
Publication number	US-11148942-B2
Application number	US-201515761192-A
Country	US
Kind code	B2
Filing date	Nov 5, 2015
Priority date	Nov 5, 2015
Publication date	Oct 19, 2021
Grant date	Oct 19, 2021

Abstract

Examples include a device comprising integrated circuit dies molded into a molded panel. The molded panel has three-dimensional features formed therein, where the three-dimensional features are associated with the integrated circuit dies. To form the three-dimensional features, a feature formation material is deposited, the molded panel is formed, and the feature formation material is removed.

First claim

The invention claimed is:

1. A process comprising:
arranging a plurality of integrated circuit dies on a carrier;
depositing a feature formation material on: a portion of an integrated circuit die of the plurality of integrated circuit dies, the carrier, or a combination thereof;
forming a molded panel comprising an epoxy mold compound, the molded panel including the plurality of integrated circuit dies and the feature formation material therein; and
removing the feature formation material from the molded panel to thereby form three-dimensional features in the molded panel, the three-dimensional features associated with the plurality of integrated circuit dies;
wherein the plurality of integrated circuit dies are fluid ejection dies, each fluid ejection die comprises a plurality of nozzles, and wherein the removing the feature formation material forms the three-dimensional features in the molded panel corresponding to fluid communication channels that are in fluid communication with the nozzles of the fluid ejection dies, and the molded panel including the fluid ejection dies and having the fluid communication channels formed therein is a fluid ejection device.

2. The process of claim 1 , further comprising:
prior to removing the feature formation material, removing portions of overmold material of the molded panel to expose at least a portion of the feature formation material.

3. The process of claim 1 , wherein forming the molded panel that includes the plurality of integrated circuit dies and the feature formation material comprises:
depositing an overmold material over the plurality of integrated circuit dies and the feature formation material; and
performing an exposed die molding process by compression molding or transfer molding the overmold material over the plurality of integrated circuit dies and the feature formation material to thereby form the molded panel.

4. The process of claim 3 , further comprising:
prior to depositing overmold material for forming the molded panel over the plurality of integrated circuit dies, electrically connecting at least one conductive trace to each integrated circuit die,
wherein the overmold material is deposited such that the at least one conductive trace electrically connected to each integrated circuit die is at least partially encapsulated by the overmold material to thereby electrically insulate the at least one conductive trace electrically connected to each integrated circuit die.

5. The process of claim 1 , further comprising:
detaching the carrier such that a fluidic channel connected to the three-dimensional features is opened on a surface of the molded panel.

6. The process of claim 1 , wherein the depositing the feature formation material comprises:
dispensing the feature formation material at least partially on the carrier.

7. The process of claim 1 , wherein the depositing the feature formation material comprising depositing a material comprising at least one of a plastic-based material, a metal-based material, an acrylic-based material, or any combination thereof.

8. The process of claim 1 , further comprising attaching the plurality of integrated circuit dies to the carrier using an adhesive tape.

9. The process of claim 8 , further comprising removing a portion of the molded panel to expose a portion of the feature formation material.

10. The process of claim 9 , further comprising releasing the carrier from the molded panel and the plurality of integrated circuit dies.

11. The process of claim 10 , wherein removing the feature forming material from the molded panel forms openings in a surface of the molded panel that is parallel with a surface of the plurality of integrated circuit dies.

12. The process of claim 8 , further comprising depositing a curable adhesive between at least some integrated circuit dies of the plurality of integrated circuit dies.

Assignees

• Hewlett Packard Development Co

Inventors

• Chen Chien-Hua
• Mourey Devin A
• Groh Michael G

Classifications

• B41J2/14072

  Electrical connections, e.g. details on electrodes, connecting the chip to the outside... · CPC title

• B81C2203/0154

  Moulding a cap over the MEMS device · CPC title

• B41J2/155

  for line printing · CPC title

• B41J2/1637

  molding · CPC title

• B01L3/0268

  using pulse dispensing or spraying, eg. inkjet type, piezo actuated ejection of droplets from capillaries · CPC title