Preventing electrode discontinuation on microdevice sidewall
US-12532724-B2 · Jan 20, 2026 · US
Processes for the planarisation of structures (planarising depositions C23C, H10)
Processes for the planarisation of structures (planarising depositions C23C, H10) · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B81C1/00611 |
| Official title | {Processes for the planarisation of structures (planarising depositions C23C, H10)} |
| Display label | Processes for the planarisation of structures (planarising depositions C23C, H10) |
| Total patents | 60 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 6 |
| 2016 | 8 |
| 2017 | 7 |
| 2018 | 7 |
| 2019 | 3 |
| 2020 | 8 |
| 2021 | 5 |
| 2022 | 5 |
| 2023 | 2 |
| 2024 | 6 |
| 2025 | 2 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Self-aligned dielectric liner structure for protection in mems comb actuator
US-2025293618-A1 · Sep 18, 2025 · US
Self-aligned dielectric liner structure for protection in MEMS comb actuator
US-12355370-B2 · Jul 8, 2025 · US
Microelectromechanical system with piezoelectric film and manufacturing method thereof
US-2024389462-A1 · Nov 21, 2024 · US
Microelectromechanical system with piezoelectric film and manufacturing method thereof
US-12133467-B2 · Oct 29, 2024 · US
Laser-assisted material phase-change and expulsion micro-machining process
US-12077432-B2 · Sep 3, 2024 · US
Self-aligned air gap formation in microelectronics packages
US-2024101413-A1 · Mar 28, 2024 · US
Flattening apparatus, article manufacturing method, flattening method, and imprinting apparatus
US-11915948-B2 · Feb 27, 2024 · US
Laser sealing and surface asperity controlling method with discontinuous laser pulses
US-2024017353-A1 · Jan 18, 2024 · US
Atomic-smooth device with microstructure, and method for preparing same
US-2023271825-A1 · Aug 31, 2023 · US
Preventing electrode discontinuation on microdevice sidewall
US-2023154790-A1 · May 18, 2023 · US
Microelectromechanical system with piezoelectric film and manufacturing method thereof
US-2022376165-A1 · Nov 24, 2022 · US
Microelectromechanical system with piezoelectric film and manufacturing method thereof
US-11482663-B2 · Oct 25, 2022 · US
Self-aligned dielectric liner structure for protection in mems comb actuator
US-2022311357-A1 · Sep 29, 2022 · US
Self-aligned dielectric liner structure for protection in MEMS comb actuator
US-11387748-B2 · Jul 12, 2022 · US
Method for manufacturing semiconductor structure and planarization process thereof
US-11377347-B2 · Jul 5, 2022 · US
Method for manufacturing semiconductor structure and planarization process thereof
US-2021354983-A1 · Nov 18, 2021 · US
Superstrate and methods of using the same
US-11018018-B2 · May 25, 2021 · US
Laser-Assisted Material Phase-Change and Expulsion Micro-Machining Process
US-2021139321-A1 · May 13, 2021 · US
Flattening apparatus, article manufacturing method, flattening method, and imprinting apparatus
US-2021090915-A1 · Mar 25, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B81C1/00611?
- CPC B81C1/00611 is the Cooperative Patent Classification code for “Processes for the planarisation of structures (planarising depositions C23C, H10).”
- How many patents are filed under CPC B81C1/00611 (Processes for the planarisation of structures (planarising depositions C23C, H10))?
- Our database includes 60 publications tagged with this CPC code.
- Is patent activity under CPC B81C1/00611 growing?
- Publication counts under this code: 6 in 2024 vs 2 in 2025 (latest complete years).