Flattening apparatus, article manufacturing method, flattening method, and imprinting apparatus

Patent metadata

Field	Value
Publication number	US-11915948-B2
Application number	US-202017024487-A
Country	US
Kind code	B2
Filing date	Sep 17, 2020
Priority date	Sep 24, 2019
Publication date	Feb 27, 2024
Grant date	Feb 27, 2024

Abstract

A flattening apparatus includes a mold holding unit configured to suck and hold a mold including a flat portion, a substrate holding unit holding a substrate, an exposure unit irradiating a light curing composition supplied onto the substrate with light at least via the mold to cure the composition, the composition being irradiated with the light and cured in a state where the flat portion of the mold is in contact with the composition on the substrate, a gas suction unit sucking gas from a spatial region between the mold and the mold holding unit, a gas supply unit supplying the gas to the spatial region, and a control unit controlling the gas suction unit and the gas supply unit to perform temperature adjustment processing for supplying the gas to the spatial region in a state where the mold is sucked and held onto the mold holding unit.

First claim

What is claimed is:

1. A flattening apparatus comprising:
a mold holding unit configured to suck and hold a mold, the mold including a flat portion;
a substrate holding unit configured to hold a substrate;
an exposure unit configured to irradiate a light curing composition supplied onto the substrate with light at least via the mold to cure the composition, the composition being irradiated with the light and cured in a state where the flat portion of the mold is in contact with the composition on the substrate;
a gas suction unit configured to suck gas from a spatial region between the mold and the mold holding unit;
a gas supply unit configured to supply the gas to the spatial region; and
a control unit configured to control the gas suction unit and the gas supply unit to perform temperature adjustment processing for supplying the gas to the spatial region in a state where the mold is sucked and held onto the mold holding unit,
wherein the control unit is configured to perform control such that processing of irradiating the composition with the light to cure the composition in a state where the mold held on the mold holding unit is brought into contact with the composition on the substrate is executed with the mold separated from the mold holding unit.

2. The flattening apparatus according to claim 1 , wherein the control unit is configured to perform control such that processing of irradiating the composition with the light to cure the composition in a state where the mold held on the mold holding unit is brought into contact with the composition on the substrate is executed after the temperature adjustment processing is started.

3. The flattening apparatus according to claim 1 , wherein the control unit is configured to supply the gas from the gas supply unit even after the mold is separated from the mold holding unit.

4. The flattening apparatus according to claim 1 ,
wherein the spatial region is partitioned into a plurality of concentric regions, and
wherein the gas supply unit and the gas suction unit are located to simultaneously suck and supply the gas from/to each of the plurality of regions.

5. The flattening apparatus according to claim 1 , wherein the gas suction unit performs the gas suction and the gas supply unit performs the gas supply via a plurality of through holes in the mold holding unit.

6. The flattening apparatus according to claim 5 , wherein a part of the plurality of through holes is used to suck the gas, and another part of the plurality of through holes is used to supply the gas.

7. The flattening apparatus according to claim 1 , further comprising a temperature control unit configured to control temperature of the gas supplied from the gas supply unit.

8. The flattening apparatus according to claim 1 , wherein the spatial region is formed by an annular protrusion on the mold holding unit contacting the mold.

9. The flattening apparatus according to claim 1 , wherein the mold is made of a light transmitting material that transmits the light from the exposure unit.

10. The flattening apparatus according to claim 1 ,
wherein the mold holding unit is made of a light transmitting material that transmits the light from the exposure unit, and
wherein the exposure unit is configured to irradiate the light curing composition supplied onto the substrate with the light via the mold and the mold holding unit.

11. An article manufacturing method comprising:
flattening a substrate by using a flattening apparatus including
a mold holding unit configured to suck and hold a mold including a flat portion,
a substrate holding unit configured to hold the substrate,
an exposure unit configured to irradiate a light curing composition supplied onto the substrate with light at least via the mold to cure the composition, the composition being irradiated with the light and cured in a state where the flat portion of the mold is in contact with the composition on the substrate,
a gas suction unit configured to suck gas from a spatial region between the mold and the mold holding unit,
a gas supply unit configured to supply the gas to the spatial region, and
a control unit configured to control the gas suction unit and the gas supply unit to perform temperature adjustment processing for supplying the gas to the spatial region in state where the mold is sucked and held onto the mold holding unit; and

processing the flattened substrate,
the processed substrate being manufactured into an article,
wherein the control unit is configured to perform control such that processing of irradiating the composition with the light to cure the composition in a state where the mold held on the mold holding unit is brought into contact with the composition on the substrate is executed with the mold separated from the mold holding unit.

12. A flattening method of a flattening apparatus including a mold holding unit configured to suck and hold a mold including a flat portion and a substrate holding unit configured to hold a substrate, the flattening apparatus being configured to irradiate a light curing composition supplied onto the substrate with light to cure the composition in a state where the flat portion of the mold is in contact with the composition on the substrate, the flattening method comprising:
adjusting temperature of the mold by supplying gas to a spatial region between the mold and the mold holding unit in a state where the mold is sucked and held onto the mold holding unit;
bringing the mold into contact with the composition on the substrate; and
irradiating the composition on the substrate with the light at least via the mold to cure the composition,
the adjusting, the bringing, and the irradiating being performed in this order,
wherein processing of irradiating the composition with the light to cure the composition in a state where the mold held on the mold holding unit is brought into contact with the composition on the substrate is executed with the mold separated from the mold holding unit.

13. The flattening method according to claim 12 ,
wherein the flattening apparatus further includes a gas suction unit configured to suck the gas from the spatial region and a gas supply region configured to supply the gas to the spatial region, and
wherein the adjusting is performed by controlling the gas suction unit and the gas supply unit.

14. The flattening method according to claim 12 ,
wherein the mold holding unit of the flattening apparatus has a plurality of through holes, and
wherein the adjusting includes sucking the gas from the spatial region via a part of the plurality of through holes and supplying the gas to the spatial region via another part of the plurality of through holes.

15. The flattening method according to claim 14 , wherein the adjusting includes switching between using the plurality of through holes to suck the gas or using the plurality of through holes to supply the gas depending on the substrate subjected to flattening processing by the flattening apparatus.

16. The flattening method according to claim 12 , wherein the bringing includes separating the mold from the mold holding unit.

17. An imprinting apparatus comprising:
a mold holding unit configured to suck and hold a mold having a patterned region;
a substrate holding unit configured to hold a substrate;
an exposure unit configured to irradiate a light curing composition supplied onto the substrate with light at least via the mold to cure the composition, the composition being irradiated with the light and cured in a state where the patterned region of the mold

Assignees

• Canon Kk

Inventors

• Yoshida Tomohiko

Classifications

• H10P72/0436

  mainly by radiation · CPC title

• H10P72/78

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• H10P72/0428 Primary

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H01L21/67092 Primary

  Electricity · mapped topic

• H01L21/67115

  Electricity · mapped topic