Laser-assisted material phase-change and expulsion micro-machining process

Patent metadata

Field	Value
Publication number	US-12077432-B2
Application number	US-202017092284-A
Country	US
Kind code	B2
Filing date	Nov 8, 2020
Priority date	Nov 8, 2019
Publication date	Sep 3, 2024
Grant date	Sep 3, 2024

Abstract

A laser micro-machining process called laser-assisted material phase-change and expulsion (LAMPE) micromachining that includes cutting features in a cutting surface of a piece of material using a pulsed laser with intensity, pulse width and pulse rate set to melt and eject liquid material without vaporizing said material, or, in the case of silicon, create an ejectible silicon oxide. Burrs are removed from the cutting surface by electro-polishing the cutting surface with a dilute acid solution using an electric potential higher than a normal electro-polishing electric potential. A multi-lamina assembly of laser-micro-machined laminates (MALL) may utilize MEMS. In the MALL process, first, the individual layers of a micro-electromechanical system (MEMS) are fabricated using the LAMPE micro-machining process. Next, the fabricated microstructure laminates are stack assembled and bonded to fabricate MEM systems. The MALL MEMS fabrication process enables greater material section and integration, greater design flexibility, low-cost manufacturing, rapid development, and integrated packaging.

First claim

We claim:

1. A laser micro-machining and assembly process comprising:
producing a plurality of layers of an object, each layer having a cutting surface;
cutting a plurality of features in the cutting surface of each layer using a pulsed laser with intensity, pulse width and pulse rate set to melt surface material and thereby create liquid material, and eject said liquid material away from the cutting surface of each layer so cut, with vaporizing of said surface material only to an extent sufficient to form vapor bubble pressure and with no oxidizing of said surface material;
removing burrs from the cutting surface of each layer after said cutting by electro-deburring the cutting surface with a dilute acid solution in the presence of an applied electric potential;
stack assembling the plurality of layers to form the object.

2. The process of claim 1 , wherein the layers are metal and wherein said liquid material is ejected away from the opposite side of the cutting surface to which the laser is directed.

3. The process of claim 2 , wherein the metal is copper.

4. The process of claim 3 , wherein the laser has a wavelength of 532 nm and a lens of focal length 100 mm, and wherein the average power and beam size results in a power density at a beam spot of 2.12 kW/mm 2 .

5. The process of claim 2 , wherein the layers are a metal alloy.

6. The process of claim 1 , wherein the layers are chosen from the group consisting of metals, ceramics, polymers and composite materials.

7. The process of claim 1 , wherein the layers are magnetic, piezoelectric, pyroelectric, thermoelectric or superconducting.

8. The process of claim 1 further comprising using a plurality of alignment pins with a plurality of alignment holes in the layers to achieve alignment of the layers during stack assembling.

9. The process of claim 1 , wherein each layer is a metal foil bonded to, or electro-plated onto a substrate during said cutting.

10. A laser micro-machining process comprising:
cutting a plurality of features in a cutting surface of a material using a pulsed laser with intensity, pulse width and pulse rate set to melt said material thereby to create liquid material, and eject said liquid material away from the cutting surface of each layer so cut, with vaporizing of said surface material only to an extent sufficient to form vapor bubble pressure;
removing burrs from the cutting surface after said cutting by electro-deburring the cutting surface with a dilute acid solution in the presence of an electric potential.

11. The process of claim 10 , wherein the cutting surface is metal and wherein said liquid material is ejected away from the opposite side of the cutting surface to which the laser is directed.

12. The process of claim 11 , wherein the metal is copper.

13. The process of claim 12 , wherein the cutting surface is a metal alloy.

14. The process of claim 11 , wherein the cutting surface is chosen from the group consisting of metals, ceramics, polymers and composite materials.

15. The process of claim 11 , wherein the cutting surface is magnetic, piezoelectric, pyroelectric, thermoelectric or superconducting.

16. The process of claim 10 , wherein the laser has a wavelength of 532 nm and a lens of focal length 100 mm, and wherein the average power and beam size results in a power density at a beam spot of 2.12 kW/mm 2 .

Assignees

• Massachusetts Inst Technology

Inventors

• Patil Prashant
• Gershenfeld Neil

Classifications

• B81C2201/0125

  Blanket removal, e.g. polishing · CPC title

• B23K2101/40

  Semiconductor devices · CPC title

• B81C2203/054

  using structural alignment aids, e.g. spacers, interposers, male/female parts, rods or balls · CPC title

• B81C2203/032

  Gluing · CPC title

• B81C2201/0143

  Focussed beam, i.e. laser, ion or e-beam · CPC title