Chip packaging method, chip packaging module, and embedded substrate chip packaging structure
US-2024413138-A1 · Dec 12, 2024 · US
US11018018B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11018018-B2 |
| Application number | US-201816210625-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 5, 2018 |
| Priority date | Dec 5, 2018 |
| Publication date | May 25, 2021 |
| Grant date | May 25, 2021 |
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An apparatus may include a superstrate. The superstrate can include a body having a diameter. The body may fit within a projected square. The projected square may have a length equal to the diameter of the body. The body within the projected square may produce an open area between an exterior edge of the body and the projected square. The superstrate may further include a first projection extending from the exterior edge of the body within the open area.
Opening claim text (preview).
What is claimed is: 1. A superstrate comprising: a body having a diameter, wherein the body fits within a projected square, wherein the projected square has a length equal to the diameter of the body; and a first projection extending from the body within the projected square. 2. The superstrate of claim 1 , wherein a length of the first projection from the body is greater than zero and is less than or equal to r√{square root over (2)}−r, where r is a radius of the body. 3. The superstrate of claim 1 , wherein the first projection is a circle. 4. The superstrate of claim 1 , wherein the first projection exists in one of four areas between the projected square and the body. 5. The superstrate of claim 4 , wherein the first projection occupies less than or equal to ¼ th the area of the projected square minus the area of the body. 6. The superstrate of claim 1 , further comprising a second projection in one of four areas between the projected square and the body, wherein the second projection is in an area not occupied by the first projection. 7. The superstrate of claim 6 , wherein a length of the second projection from the body is greater than zero and is less than or equal to r√{square root over (2)}−r, where r is a radius of the body. 8. The superstrate of claim 6 , further comprising: a third projection in one of four areas between the projected square and the body, wherein the third projection is in an area not occupied by either the first projection or second projection. 9. The superstrate of claim 8 , further comprising: a fourth projection in one of four areas between the projected square and the body, wherein the fourth projection is in an area not occupied by any of the first projection, second projection, or third projection. 10. The superstrate of claim 8 , wherein a length of the third projection from the body is greater than zero and is less than or equal to r√{square root over (2)}−r, where r is the radius of the body. 11. The superstrate of claim 9 , wherein a length of the fourth projection from the body is greater than zero and is less than or equal to r√{square root over (2)}−r, where r is the radius of the body. 12. The superstrate of claim 1 , further comprising a mesa. 13. The superstrate of claim 6 , wherein the first projection is opposite the second projection from the center of the body. 14. The superstrate of claim 1 , wherein the first projection has multiple waves or curves. 15. A method of forming a planarization layer, comprising: depositing a formable material on a substrate; contacting a superstrate with the formable material on the substrate; and separating the superstrate and the formable material on the substrate, the superstrate comprising: a body having a diameter, wherein the body fits within a projected square, wherein the projected square has a length equal to the diameter of the body; and a first projection extending from the body within the projected square. 16. The method of claim 15 , wherein separating the superstrate and the substrate is by applying a force on the first projection. 17. The method of claim 15 , wherein a length of the first projection from the body is greater than zero and is less than or equal to r√{square root over (2)}−r, where r is the radius of the body. 18. A method of manufacturing an article, comprising: depositing a formable material on a substrate; contacting a superstrate with the formable material on the substrate, the superstrate comprising: a body having a diameter, wherein the body fits within a projected square, wherein the projected square has a length equal to the diameter of the body; and a first projection extending from the body within the projected square; curing the formable material to form a planar layer; separating the superstrate and the formable material on the substrate; processing the substrate on which the planar layer has been formed; and manufacturing the article from the processed substrate. 19. The method of manufacturing an article of claim 18 , wherein separating the superstrate and the substrate is by applying a force on the first projection. 20. The method of manufacturing an article of claim 18 , wherein the superstrate further comprises a second projection extending from the body, and wherein separating the superstrate and the formable material on the substrate is by applying force on the second projection.
Planarisation of inorganic insulating materials · CPC title
Planarisation of organic insulating materials · CPC title
characterised by the choice of material · CPC title
characterised by the shape of the surface · CPC title
forming a microstructure, i.e. fine patterning · CPC title
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