Packaged semiconductor devices and methods for producing packaged semiconductor devices
US-2019270636-A1 · Sep 5, 2019 · US
for controlling the passage of optical signals through the package
for controlling the passage of optical signals through the package · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B81B7/0067 |
| Official title | {for controlling the passage of optical signals through the package} |
| Display label | for controlling the passage of optical signals through the package |
| Total patents | 181 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 8 |
| 2016 | 17 |
| 2017 | 11 |
| 2018 | 20 |
| 2019 | 16 |
| 2020 | 29 |
| 2021 | 18 |
| 2022 | 16 |
| 2023 | 15 |
| 2024 | 18 |
| 2025 | 10 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Lighting module for motor vehicle projector
US-2019154226-A1 · May 23, 2019 · US
Electro-optic device, electro-optic unit, and electronic apparatus
US-10261311-B2 · Apr 16, 2019 · US
Wearable infrared temperature sensing device
US-2019086267-A1 · Mar 21, 2019 · US
Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus
US-10156779-B2 · Dec 18, 2018 · US
MEMS Package
US-2018297834-A1 · Oct 18, 2018 · US
Mems device package and method for packaging mems device
US-2018297836-A1 · Oct 18, 2018 · US
Manufacturing method for a micromechanical device including an oblique surface and corresponding micromechanical device
US-2018257932-A1 · Sep 13, 2018 · US
Optical electronics device
US-2018257930-A1 · Sep 13, 2018 · US
Electro-optic device, electro-optic unit, and electronic apparatus
US-2018188524-A1 · Jul 5, 2018 · US
Assembly body for micromirror chips, mirror device and production method for a mirror device
US-10012828-B2 · Jul 3, 2018 · US
Optical electronic device and method of fabrication
US-9994441-B2 · Jun 12, 2018 · US
Multi-device transducer modulus, electronic apparatus including the transducer modulus and method for manufacturing the transducer modulus
US-2018148323-A1 · May 31, 2018 · US
Integrated micro-channel heatsink in DMD substrate for enhanced cooling capacity
US-9971147-B2 · May 15, 2018 · US
Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus
US-2018120681-A1 · May 3, 2018 · US
Position detection method and optical module
US-2018120156-A1 · May 3, 2018 · US
Method for manufacturing a protective wafer including inclined optical windows and device
US-2018113300-A1 · Apr 26, 2018 · US
Electro-optic device, electro-optic unit, and electronic apparatus
US-9933614-B2 · Apr 3, 2018 · US
Electro-optic device, eletro-optic unit, and electronic apparatus
US-9933615-B2 · Apr 3, 2018 · US
Integrated micro-channel heatsink in dmd substrate for enhanced cooling capacity
US-2018088319-A1 · Mar 29, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B81B7/0067?
- CPC B81B7/0067 is the Cooperative Patent Classification code for “for controlling the passage of optical signals through the package.”
- How many patents are filed under CPC B81B7/0067 (for controlling the passage of optical signals through the package)?
- Our database includes 181 publications tagged with this CPC code.
- Is patent activity under CPC B81B7/0067 growing?
- Publication counts under this code: 18 in 2024 vs 10 in 2025 (latest complete years).